Electronics Forum | Fri Nov 22 08:59:49 EST 2002 | ksfacinelli
I would have to agree with the to high temp being a real problem. I have seen this with the WS-609 alpha paste. If you run it up to high in temp. The joints appear to be cold but they are really just over fried.....definitely try reducing temperat
Electronics Forum | Tue Dec 10 22:18:32 EST 2002 | davef
Randy's correct. If you were soldering to nickel with WS609, you would be complaining about non-wetting, not lumpy solder flow.
Electronics Forum | Fri Jul 23 09:17:16 EDT 2004 | davef
The more we think about this, the more we think you should join the 20th century and upgrade from your good ol' WS609. We know this will be tough. We used the stuff for 10s of years.
Electronics Forum | Mon Jan 21 16:13:50 EST 2008 | arun2382
We see delamination at Mold compound to substrate interface when tested for MSL3. We haven't tested the substrate for cleanliness. Can you please suggest methods for this? thanks, arun
Electronics Forum | Mon Feb 04 07:43:02 EST 2008 | davef
Bruce: We know Arun is not cleaning the board properly. Arun does not know how to determine if the board is clean. Arun doesn't know how long to clean the board. Apparently, you do. Tell Arun the answers.
Electronics Forum | Mon Apr 17 18:42:32 EDT 2000 | Russ
Murad, I have just completed a switch over in our facility to no-clean. We used Alpha 609 and 857 paste and wave flux respectively. We currently use Alpha UP78 paste, NR330 wave flux, NR205 liquid flux for touchup and cleanline 7000 wire solder as
Electronics Forum | Wed Apr 09 13:30:20 EDT 2003 | davef
In order to get reliable reflow, you need to be at or higher than [liquidus + 20*C] for about 5 to 10 seconds. [I said 25* in a earlier post, but in an effort to stay on message, I'll stick with 20*] Don't forget that your liquidous is probably NOT
Electronics Forum | Fri Oct 18 07:14:51 EDT 2002 | cyber_wolf
Have you tried using a paste with a more aggressive flux? Our main paste is Indium, but whenever we run into oxidized parts or have soldering problems due to oxidation on pads we use an older Alpha WS paste called WS609. The drawback of this paste is
Electronics Forum | Sat Jun 26 15:26:10 EDT 2004 | russ
I am very happy with Alpha Metals WS709 or even WS609. Almost all of our product is Immersion gold and we place down to 16mil pitch every day along with 0201 and uBGA. Immersion gold from my experience, solders extremely well with every paste I hav
Electronics Forum | Tue Jan 29 19:47:36 EST 2008 | davef
Bruce Barton: We're not intending to suggest that anyone is purposely leaving WS flux residue on the board after cleaning. Fact is, Arun isn't sure if the boards are completely clean. Arun said, "We haven't tested the substrate for cleanliness." Gi
