Electronics Forum | Tue Apr 11 20:31:54 EDT 2000 | Dave F
Russ: You�re correct. I should have explained our reasons for preferring concave over convex better. First, we use both also ... we just prefer concave because they: * Don�t bridge any where near as easily. * Self-center better. * Seem to have mor
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
Electronics Forum | Mon Feb 26 12:26:43 EST 2001 | CAM
I'm working a problem and looking for your input. Here the deal: Two sided mix technology board. Test is using unmasked via points on bottom for test points. Our fab drawing states tent via points on top side. First set of board came in with no tenti
Electronics Forum | Tue Feb 27 07:51:59 EST 2001 | jackofalltrades
We use Selective Wave Pallets for the vast majority of our boards with great success. Many of our boards have BGA's and connectors on both sides, which for the most part then require the Selective Wave Pallet. We successfully use pallets up to 10mm t
Electronics Forum | Fri Nov 12 13:05:36 EST 1999 | Brian W.
As a CM, I have had customers stack components as a temporary measure of incorporating an ECO. Most of the time, it includes using an adhesive to secure the component. Cost of material already in-house is the major factor when this occurs. Even th
Electronics Forum | Wed Oct 06 22:02:48 EDT 1999 | JAX
| Our first article inspection after machine placement can take several hours depending on the complexity of the board. The operator visually checks the board against the drawing and bill of material. I'd be interested to hear if there are any other
Electronics Forum | Thu Oct 07 04:46:03 EDT 1999 | Wolfgang Busko
| Our first article inspection after machine placement can take several hours depending on the complexity of the board. The operator visually checks the board against the drawing and bill of material. I'd be interested to hear if there are any other
Electronics Forum | Mon Sep 20 14:06:02 EDT 1999 | Claude Couture
| Can anyone help with programming a D^2 Pak on a Panasert MV100. I'm having trouble setting up the parts data and teach the component. What should the Up, Down, Left, Right, Component Code, Lead Details, and Cut Lead Settings be? | A link to the pac
Electronics Forum | Wed Sep 22 21:07:00 EDT 1999 | JAX
| Can anyone help with programming a D^2 Pak on a Panasert MV100. I'm having trouble setting up the parts data and teach the component. What should the Up, Down, Left, Right, Component Code, Lead Details, and Cut Lead Settings be? | A link to the pac
Electronics Forum | Sun Aug 15 14:56:03 EDT 1999 | Dean
| One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact with th
