Electronics Forum | Wed Jul 29 07:26:12 EDT 2009 | dilogic
Hi Patrick, thanks for the response. I might add some more information - we succesfully soldered some boards with the same settings of belt speed, pre-heat temp. etc. This batch of boards differs from the previous in a way that they are 4-layer. May
Electronics Forum | Mon Jan 17 21:14:19 EST 2011 | hegemon
Of the machines you have mentioned, the APE Bandit is your best bet. I had one of those in a previous employ and it was basically bulletproof, and simple enough to work on if things went wrong. Simple controllers and enough power to do the job at r
Electronics Forum | Sat Aug 29 21:42:46 EDT 2015 | sarason
When I made my previous reply, I don't think I was very clear in what I said, so like any politician I will rephrase my response to the question. My intent was that the board didn't have enough soak time leading up to final reflow. So what was happen
Electronics Forum | Wed Mar 01 02:10:05 EST 2017 | soldertraining
Hi! I am Bob and pls forgive me if technical words I use are wrong. What may cause the BGA solder pad lift before or after reball? I am having problems where solder pad lifted during removal of bad solder ball. It also occurred during reball, where t
Electronics Forum | Tue Dec 11 18:50:47 EST 2018 | vinzon02
HI Rob; The thermal conductive adhesive needs to apply heat to stick on PCB. It's surface has not adhesive tape to fix it before placement of IC. Process: 1.Place the epoxy adhesive tape on PCB. (IC middle part area) 2.Apply heat on epoxy adhesive
Electronics Forum | Tue Jul 16 02:18:42 EDT 2019 | sy332366
Specifications : S-8800 Number Of Heating Zones :Up8/Bottom8 Dimension (L*W*H)mm: 5310x1353x1490 Dimension (L*W*H)mm: 5310x1353x1490 Number Of Heating Zones : Up8/Bottom8 Length Of Heating Zones : 3121mm Control System : PLC+Computer Transmission Age
Electronics Forum | Tue Jun 23 01:04:26 EDT 2020 | kylehunter
Thanks for your thoughts. So it seems then that the temperatures that we're seeing aren't unusual, and just need to sort out the fan issue... @Sr. Tech: Yeah, totally understand the radiator effect. Once the fan issue is sorted, we plan on insulatin
Electronics Forum | Tue May 04 10:38:24 EDT 1999 | Dave F
| Does someone has experience with solder stop on components to avoid an Viking effect (no solder on the pad, all solder on the lead)? What kind of solder stop does work well? What is dangerous? What has to be kept in mind when using such components?
Electronics Forum | Wed Jan 23 23:45:35 EST 2019 | kiransahu
Piezoelectric type (office/industrial) In this method, a piezoelectric (piezo) element, whose volume is deformed when voltage is applied, is used to discharge ink particles. This element is attached to the component that is filled with ink. Then, th
Electronics Forum | Wed Feb 23 20:29:43 EST 2000 | Rex B
ECD is working on some tools in the area of determining the Ideal or most Robust Profile, for a given paste, oven configuration and conveyor speed. Translation of this "most robust profile" into actual oven setting requires more knowledge about the
