Electronics Forum: viewed (Page 3355 of 7892)

Any TWS QUADRA P&P FOR SALE??

Electronics Forum | Tue Sep 17 11:41:04 EDT 2019 | picotec

Hi,sorry for late reply DO you still has feeder to sell? If yes èlease let me know type and money request to pierre@picotec.it Many tks Pierre

NXP QFN Solderability Wetting Problems, Kester

Electronics Forum | Mon Aug 14 14:53:51 EDT 2017 | emeto

AIM, Indium , Alpha will be your top 3 choices. I did paste evaluation before with 4 paste manufacturers and Kester was my choice number 4. Profile according to the paste specs and observe results.

Universal Instruments or Mirae

Electronics Forum | Thu Aug 10 14:38:56 EDT 2017 | emeto

From the specs that I see online it looks that UIC Fuzion can make 150k/h and Mirae 55k/h. Define machines and we can talk.

Looking for AOI Development History

Electronics Forum | Thu Aug 10 11:36:13 EDT 2017 | dhanson

Hello, I am looking for information regarding the history of the development of automated optical inspection technology from when it was first conceived to today. I would generally like a timeline from milestone achievements that really progressed t

Issues with Immersion silver

Electronics Forum | Fri Aug 11 14:29:58 EDT 2017 | abruno1995

I am having issues with this. I am having excess plating on my pcb board and i want to know if this is a ICP Class 1-3 Issue. 1. Excess Plating 2. Dark Vias Thank you

Topaz X Software

Electronics Forum | Mon Aug 14 18:59:55 EDT 2017 | selectpcb

Yes, it is cad2cad, my fault I was in the middle of another project. I am looking for a cad2cad 1.5 software for my new Topaz X. Can anyone help.

Topaz X Software

Electronics Forum | Tue Aug 15 19:19:57 EDT 2017 | selectpcb

Can anyone help in locating cad2cad 1.5 software for my Phillips Topaz X. I'm having such a difficult time locating it.

Tombstone components issue after reflow?

Electronics Forum | Sat Aug 12 02:52:16 EDT 2017 | tsvetan

There is no solution in above case, this is caused by the PCB design. There are no thermals on the pads connected to the copper poured area. So the other pad reflow first and lift the component.

Tombstone components issue after reflow?

Electronics Forum | Wed Aug 16 14:36:06 EDT 2017 | duchoang

Not enough solderpaste. Uneven solderpaste volume on pads. Bad quality of caps ( Metal ends), try new cap manufacturer, sound weird, huh!! but that happened to me. Good luck.

Component Drop on Second side of the reflow

Electronics Forum | Sun Aug 13 01:32:57 EDT 2017 | sankarseptember

These two components are tallest among other components.Is there any method to check pad size required according to component leads?


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