Electronics Forum | Tue Aug 24 15:10:14 EDT 1999 | Ian T
| | | | | Hello everyone, | | | | | We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Thanks in ad
Electronics Forum | Wed Aug 25 01:25:49 EDT 1999 | Gyver
| | | | | | Hello everyone, | | | | | | We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Thanks i
Electronics Forum | Tue Aug 03 03:33:12 EDT 1999 | Smitty
| | | HI EVERYONE, | | | WE JUST BOUGHT 6 FCM MACHINES AND ARE HAVING | | | A NUMERIOUS AMOUNT OF DOWN TIME COMPARED TO | | | OUR 5 LINES OF FUJI EQUIPMENT.IS ANYONE HAVING | | | BAD EXPERIENCE WITH PHILIPS FCM ETC? | | | | | | WHAT PROBLEMS ARE
Electronics Forum | Wed Aug 04 01:03:16 EDT 1999 | Dean
| | | | HI EVERYONE, | | | | WE JUST BOUGHT 6 FCM MACHINES AND ARE HAVING | | | | A NUMERIOUS AMOUNT OF DOWN TIME COMPARED TO | | | | OUR 5 LINES OF FUJI EQUIPMENT.IS ANYONE HAVING | | | | BAD EXPERIENCE WITH PHILIPS FCM ETC? | | | | | | | | WHAT
Electronics Forum | Thu Aug 05 03:20:16 EDT 1999 | KEVIN SIMPSON
| | | | | HI EVERYONE, | | | | | WE JUST BOUGHT 6 FCM MACHINES AND ARE HAVING | | | | | A NUMERIOUS AMOUNT OF DOWN TIME COMPARED TO | | | | | OUR 5 LINES OF FUJI EQUIPMENT.IS ANYONE HAVING | | | | | BAD EXPERIENCE WITH PHILIPS FCM ETC? | | | | | |
Electronics Forum | Tue Jul 27 14:56:23 EDT 1999 | John Thorup
| | | | We are currently using a 65/35 solder for our wave process but are considering switching to a 63/37 for a substantial cost savings. No one here seems to know why we everused a 65/35 formulation in the first place. | | | | I understand 63/37 t
Electronics Forum | Fri Jul 16 14:05:04 EDT 1999 | Jim Blankenhorn
| | | Hi all , | | | | | | We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: | | | | | | 1. Is underfill required for micro-BGAs? | | | | | | 2. What type of stencil apertures are t
Electronics Forum | Fri Jun 18 10:46:10 EDT 1999 | Scott Cook
| | | first of all what is the technical term for the small amount of solder on a plated pad. we are getting poor screen printing gasketing on a 20 mil qfp due to this solder not being even or too high in spots and not covering the length of the pads
Electronics Forum | Sat Jun 12 16:33:52 EDT 1999 | JohnW
| | Our company is experiencing cracked caps at our pick and place operations. The caps are being placed onto epoxy dots for subsequent wave solder operations. At present, be have set the pressure of the head at 2 in/lbs. This being down from manuf
Electronics Forum | Fri May 07 08:06:03 EDT 1999 | Hon Choi
| | Hi all, | | | | We're starting up tests for pin-to-paste and, well, things could be better. We're testing different pastes and we're testing different apertures rules and, well, we're still testing. It's coming close and we're getting pretty
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