Electronics Forum | Sun May 19 06:43:37 EDT 2002 | xzinxzin
I using water-soluble solder paste, the solder paste recommended, the peak temperature is 215 deg C, the dwell time above 183 deg C is 60-90 sec. **How I can do, the flux in solder paste is active enough to remove the corrosion on the Cu leads to get
Electronics Forum | Fri May 31 15:24:17 EDT 2002 | davekalen
I have seen manufacturing leave the rust belt for Mexico and I am now seeing Mexico plants closing and work going to China. I know that the equipment sales are really in a slump as everyone else has said. It is interesting to see that company after c
Electronics Forum | Tue May 28 10:59:56 EDT 2002 | Por
All Could anybody help to let me know the effect of AXAREL 36 (Petroferm Inc.) on electronic device for cleaning PCBA application. I am process engineer and currently using Prozone solvent and Axarel 32 to be cleaning solder for smear board cleani
Electronics Forum | Tue Jun 04 19:15:15 EDT 2002 | rob_thomas
Por, Why do you clean no-clean flux residue?I didn't use the product you mentioned but I got some help from the folks at Cookson group last year when I did wirebonding after no-clean smt processing.check their website.Check your profile as well.unles
Electronics Forum | Thu May 30 07:28:15 EDT 2002 | jaltland
Ben, Thanks for the input on the apertures and thickness. The side two problem, is not reflow. We have no trouble with reflow. The problem is that our product is high precision crystal oscillators. In order to get the precision needed, we have t
Electronics Forum | Wed Jun 12 11:14:57 EDT 2002 | pjc
Sam, Like I said, AOI for pre-reflow inspections is the easiest to program and maintain. Each vendor of AOI has its pluses and minuses for programming and performance. Do a careful investigation of each vendor to learn about their machine performanc
Electronics Forum | Sat Jun 15 22:39:05 EDT 2002 | edahi
well we can't paste the flip chip on its substrate because we are using flux...because this bare die yet...and the surface of the die flipped might be contaminated...also after chip attach and reflow the die is to be underfilled and if the die is pas
Electronics Forum | Mon Jul 01 21:03:15 EDT 2002 | ianchan
Dason: Hi mate, Could you help clarify this abit? ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ we found component weight will reduce more than 50% of the moisture weight after place in the cabinet with 55C and less than 5 % for 48 hours ~~~~~~~~~~~~~~~~~~~~~
Electronics Forum | Fri Jun 28 03:04:21 EDT 2002 | Dreamsniper
Forgot to include the following: Dwell time is from 55 secs to 68 secs. Indium specs for the paste is maximum peak @ 228'C and 30 to 90 secs dwell time above 183'C. PCB is a 6 layer board with Dimension of 205 x 166 mm but is slightly dense with 11
Electronics Forum | Mon Jul 08 09:52:37 EDT 2002 | gdstanton
Folks, Looking for some feedback from anyone who has had experience with panelized or palletized CCAs, or anyone interesting on commenting, where interconnects were used to facilited a "gang" incircuit and functional test. We are considering implem
