Electronics Forum | Tue Aug 01 16:39:24 EDT 2006 | slthomas
Our problem is with the chamber beneath the drying section, where the blower is. The drying section vents directly into the chamber beneath it where the blower intake is, which is great for equalizing pressure but really counter to presenting dry air
Electronics Forum | Wed Sep 13 08:08:56 EDT 2006 | meritajs
Hi Davef and Rob, Thank Davef for your advice,we will make "dip&look" soldering test. Rob,we are tolking about companents storage time after manufacturing. Sometime we get companents which was shipment more then year ago In many cases we have problem
Electronics Forum | Thu Oct 05 15:58:16 EDT 2006 | RusH
Mario, Thanks for your response. We are building a leaded assembly with hot air leveled Sn/Pb pads on the PCB. In one case the component is a 7.5X5.2X1.8 wire wound ferrite inductor with Au/Sn leads. The second component is an 0808 Tantalum cap,
Electronics Forum | Tue Dec 26 10:54:37 EST 2006 | yusufgomec
We use hot air leveling (HAL) process in pcb production. HAL process is 3 steps. �n 1. step flux. 2. step is HAL. And 3. step is rinsing. As you know there is mustn't any flux after rinsing operation. Our flux chemical is water soluable. But there ar
Electronics Forum | Tue Feb 27 22:40:28 EST 2007 | davef
IPC-A-600G, 2.9 Solder Resist [Solder Mask] [snip]"Solder resists are used to limit and control the application of solder to selected areas of the printed circuit board during assembly soldering operations and are sometimes used to reduce dendritic f
Electronics Forum | Tue Jun 12 22:03:21 EDT 2007 | davef
The presence of agitation at an air / solution interface and a foaming agent causes foaming. Most water soluable fluxes contain surficants. Surficants are foaming agents. First, it's likely this foaming is caused by poor control of the temperature o
Electronics Forum | Fri Jun 22 01:51:41 EDT 2007 | jmelson
&F(27).NO4=0 NO4 is for the prep head, which you probably don't have. So, it is zero to mean don't use the prep head. &F(27).DSPF=1 This is the "display flag", it apparently means this component slot in the file contains valid data for a real compon
Electronics Forum | Tue Jun 26 14:28:50 EDT 2007 | bjrap3
I have been trying to rework a lead-free BGA. For some reason, when I remove the BGA the corner pads on the board come off and the board must be scrapped. If I do manage to remove the BGA successfully, when I solder the BGA, the corners of the BGA
Electronics Forum | Thu Aug 16 10:59:08 EDT 2007 | mika
Did You recieve any s/w with it? If something has happend to the hard drive or something could happens in the future then you need to reinstall... S/W ver. is written on the the s/w package. It should contain s/w for: The OS (Operating system), Visi
Electronics Forum | Fri Sep 28 04:49:09 EDT 2007 | gregoryyork
Just a shame that the HASL fluids that are used contain Hydrobromic or hydrochloric acids or a mixture of the two and are full of strong wetting agents that are NON IONIC so the IC test results mean very little as they are checking for Ionics only. P
