Electronics Forum: surface and mount (Page 35 of 131)

Expected pick and place precision for 0603 LEDs?

Electronics Forum | Wed Nov 13 15:33:08 EST 2013 | mondalaci

Good question :) I'd say with a machine that is available for an average pick and place operator nowadays. Our manufacturer is not fixed yet, that's why I don't have any specific. On a related note I'm wondering whether the machine is so importan

cap size and copper thickness vs part size questions

Electronics Forum | Mon Nov 07 12:25:32 EST 2005 | Rob

Hi CW, Larger chip caps can be susceptable to cracking, but mainly this is due to handling - flexing of boards is the main culprit (the part being mechanically joined at both ends to the board). PCB's usually flex easiest along one axis, and larger

cost analysis: Manual vs. Auto insertion pick and place

Electronics Forum | Fri Aug 04 13:47:20 EDT 2006 | pemea1

apples to apples. 20 boards 80 parts top and 10 parts bottom. these boards are done on a semi regular basis (you know the boards are coming to you from an OEM at least three times a month, just no exact schedule). All that is required is pasting..mo

[S] Ipulse M1 - F1 and PS84 feeder documentation

Electronics Forum | Sun Nov 28 02:23:38 EST 2021 | tueftler

Hi there. I have an Ipulse M1 mounting mashine. For that i have PS84 and F1 Feeders. Now i have a strange behavior with my new F1-16 feeder. The machine dont had the F1-16 feeder type on its library. So i have insert it by myself. The problem is, th

Need help on PCBA Cleanliness Standards and Specs

Electronics Forum | Tue Nov 25 16:26:43 EST 2003 | tdurston

We are trying to establish requirements and process controls for completed, cleaned SMT assemblies. We have problems with our high impedance circuits (100 meg ohms) being affected by residue. Some boards require additional cleaning cycles to remove

Volume and average height of solder paste after printing machine

Electronics Forum | Thu Oct 02 12:22:26 EDT 2008 | JerryS

Hello Ok there is not much info here. What you have to mae sure of is several key factors. 1. Have you entered the correct stencil thickness. 2. Are you using the stencil gerber (not the paste layer) The paste layer is usually not adjusted for ap

Solder Skips and Shorts on Lambda Wave, Omega Upgrade?

Electronics Forum | Mon Aug 13 09:49:35 EDT 2012 | rjlatz

I just got back from a visit to our PCBA manufacturer. We have good flowthrough on the PTH, but solder skips and bridges on the SMT SO IC's. We have correct orientation and robber pads, but the results are still the same. I noticed the wave shape is

MEMS Microphone Surface Mount

Electronics Forum | Mon Nov 03 22:38:39 EST 2014 | dustind

Hi there! I'm an engineering student from Toronto, ON looking for someone to mount a MEMS microphone for me for a school design project. Trouble is, I need a reflow oven for the proper surface mount and my university doesn't have access to one. K

Re: Pb alloy reflow temperatures and component integrity

Electronics Forum | Tue Aug 22 16:02:07 EDT 2000 | Dr. Ning-Cheng Lee

If the thermal mass of the products is small, a tent-shaped profile is recommended, with peak temperature around 240C. The hottest spot on board should be less than 250C. However, if the thermal mass of the product is large, such as a large server PC

environment Operational deg-C and RH% for Paste Printer

Electronics Forum | Thu Jun 06 02:27:43 EDT 2002 | ianchan

Hi mates, does anyone know if there is a industrial standard spec for environment(deg-C, RH%) operational use of Paste Printer machines? If there is no study to define a deg-C, RH% specs for immediate environemnt operation use of a paste printer ma


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