Electronics Forum | Fri Feb 21 00:44:56 EST 2003 | MA/NY DDave
Hi I guess I would call Locktite. I see David F expects that something isn't giving you a good bond strength and wants you to test it after initial application for good adherence. Check this out since his ideas are the most natural. In addition,
Electronics Forum | Mon Feb 24 20:51:52 EST 2003 | davef
Ryan, You are spot-on with your analysis of the 'flattened' glue deposits. How about this for a different approach[es] in explaining your method for removing caps from your board? * George Verboven has speculated here on SMTnet that the downward fo
Electronics Forum | Fri Mar 21 18:12:31 EST 2003 | Judy
I look at boards coming out of the oven top side and bottom If I take that board after its been glued on bottom side out of the oven and look at the top side when I pick up that board you should see the glue parts that fell off you really have to wa
Electronics Forum | Tue Mar 11 04:17:39 EST 2003 | emeto
Ok. The best ways: 1.Wave A.Secondary side(SMD only)with glue. B.Primary side (smd+TH) c.Wave both sides(or wave and reflow) 2.If you can't solder the primary side or you don't use dispenser use classic way with reflow and trough hole at the end of
Electronics Forum | Wed Mar 05 03:43:58 EST 2003 | testing
Hi, Mike Thanks for the reply With your oracle system were you able to perfom SPC analysis? and if possible do you have any Material that may be helpful for me to get my system setup i.e. whether through Excel, Access, Oracle etc. + What are your
Electronics Forum | Fri Mar 07 14:48:34 EST 2003 | gdstanton
Pretty much everything under the sun. For example if Company A wanted to hire Company B to build printed circuit cards designed by Company A; What type of T & C might Company B seek in their contract/agreement with Company A? The following things c
Electronics Forum | Tue Mar 11 12:43:27 EST 2003 | MA/NY DDave
Hey Frank, We got lucky. An article just appeared in one of our industry's magazines. Now you still have to read these articles carefully since the proponents sell the equipment yet it does support both opinions. Except it says (before PnP) and (p
Electronics Forum | Wed Apr 09 09:48:49 EDT 2003 | iman
after oven bake dry the PCB, we process within 4-hrs, else need to rebake again under same baking parameter. taking a look, the exact pads with the blowholes are full ENIG pads with no via holes under the solder-intend land areas. In event there is
Electronics Forum | Mon Mar 31 01:11:14 EST 2003 | yukim
Hi, we are about to change solder paste for cost issue. Currently using a no clean Sn63 solder paste and tried several others, all no clean, Sn63 and Sn62. Want to ask about reliability test: we did thermal shock test for 8 days. The flux residue cha
Electronics Forum | Wed Apr 09 23:37:52 EDT 2003 | MA/NY DDave
Hi I know what DaveF is saying about the Kapton situation, yet from what I remember also at a KIC presentation the Kapton technique wasn't given as bad a billing as Dave describes. You do have to make sure you get a good firm contact and verify it
