Electronics Forum: change (Page 370 of 516)

Oop's Pb BGA's in a RoHS process?

Electronics Forum | Thu Jun 22 13:53:43 EDT 2006 | grantp

Hi, Yes, I agree, and it seems like these studies were designed to show that lead free soldering was better than lead based soldering, and they threw in some results of lead components soldered in a lead free process, which seemed about the same rel

CP4 Production

Electronics Forum | Thu Jun 29 08:31:03 EDT 2006 | MarkM.

Hello all, I have a dilemma at the moment with my CP4 pick and place positions. I get alot of parts in the rear of the machine and inside. I also as of late starting to get parts flying around on the boards once in awhile. I have checked pick positi

Solder beads and wave soldering

Electronics Forum | Mon Jul 03 05:39:05 EDT 2006 | ronalds

Hi, I am experience problems while testing wave soldering SMT components that are glued on the solderside (lead free). Between de leads of SOx type IC's and SOT's develop a great deal of solder beads. I have been using a RSS temp.profile while spr

SIR Testing

Electronics Forum | Tue Jul 04 02:31:55 EDT 2006 | Mustang

Calling for an input from the Experts our there. Our customer is questioning the cleanliness of the no-clean product that we produced for them. We were asked to clean the board (localised cleaning) after rework (IC need to be changed due to an up re

SMT p&p new line

Electronics Forum | Thu Jul 20 11:28:40 EDT 2006 | Rob

Mydata are OK, but they will not last as long as the Siplace if running the same volume. They are easy to programme, change over & upgrade - they are very good entry level machines. One thing to remember is that they make use of large scale gang pi

Siemens SiPlace, Model 80 S20 FS02

Electronics Forum | Fri Jul 28 09:35:12 EDT 2006 | chrisgriffin

I think Siemens 80 S20 is a great machine. I worked on them for a few years, with very little problems. They are extremely easy to maintain. I think a complete PM took about an hour. The software is good and user friendly. You can change one over

Solder Ball After Reflow Process

Electronics Forum | Mon Aug 21 08:34:09 EDT 2006 | Chunks

Larry, You always seem to twist things back to your wave solder process, ya nut! Anyway, why over simplify things when you are trouble shooting a process? The K.I.S.S. process was invented by your generation so I thought you of all people would l

Chip capacitor size - Fuji CP6

Electronics Forum | Mon Aug 21 04:20:49 EDT 2006 | Rob

Hi Mika, I used to work for the largest chip cap manufacturer in the world, and by far the largest problem we would see was cracking due to incorrect z height adjustment on Chipshooters. It can also cause solderballs and bad joints by displacing th

Chip capacitor size - Fuji CP6

Electronics Forum | Mon Aug 21 10:36:25 EDT 2006 | vikkaraja

I Think I understand your problem. But I think it would be best if you just go in the program and change/check your componet height as needed. It does not take much time. Check your cap height, modify shape data as needed, generate your program and

Can you wave solder this part

Electronics Forum | Thu Aug 24 19:26:07 EDT 2006 | darby

Dave, Cygnal was taken over by Silabs. I based my design on the second link that you provided. Tell me folks, are you using one large pad with only the stencil having the grid, or are you actually breaking up the large pad into grids with mask around


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