Electronics Forum: designation (Page 371 of 537)

Non-Waveable SMT Caps

Electronics Forum | Mon Jun 25 20:54:28 EDT 2001 | davef

No, I�m suggesting an increase in the distance between the two pads on the board. This "G" in SM-782A "Surface Mount design & Land Pattern Standard" parlance. You shouldn�t fight solder balls for long periods. You should just increase the pressure

Dream Machine

Electronics Forum | Sat Jun 30 14:17:53 EDT 2001 | stefwitt

I would highly recommend that you test drive your vehicle before you buy it. Buy a test kit from Topline and have a stencil made. Make an appointment with the machine manufacturer and let them know that you come with your own boards and components.

QFP Defect

Electronics Forum | Wed Jul 11 13:41:37 EDT 2001 | procon

Hi Chris, Dave F is absolutely correct in his assunption that the leads are hotter than the pads. You must profile from the pads to see the exact temperature that they are reaching. If the entire board reflows properly as you described, don't get ca

Question on Nitrogen Consumption during Reflow

Electronics Forum | Mon Jul 02 14:47:24 EDT 2001 | gdstanton

Thanks. I saw your response to Gabby on May 23 2000. Sent a request to Christina Cotto at Reedexpo.com. She's going to send me copies of the Nepcon papers you referenced. Although, I did some guestimating and ballparked a monthly cost of $338k

Bent leads on QFP's

Electronics Forum | Sat Jun 30 11:05:31 EDT 2001 | davef

Sohowcum, yer not just sending the bent-up leaded QFP back to the sorry behinds that sent them to you and telling �em they aint no good!!! Gimme goodins!!! [Er, words to that effect.] For QFP lead reconditioning equipment suppliers, try: * Knight

EPTSSOP

Electronics Forum | Thu Jul 19 21:55:14 EDT 2001 | davef

You're correct, but you need to take it a little bit further. Installed correctly, ExposedPad� TSSOP IC packages significantly increase the thermal efficiency of power constrained standard TSSOP packages. This can increase heat dissipation by as mu

Solder Paste Reflow Profiling

Electronics Forum | Mon Jul 23 12:12:57 EDT 2001 | kennyhktan

Good day! As we all know the normal recommended solder paste(Sn62/Pb37) reflow profile time is around 40~60sec above the temperature of melting point. Now I'm setting my peak temperature at the high site of solder paste recommended spec. due to metal

Feeders' historical record/ tracking database

Electronics Forum | Thu Jul 26 06:39:19 EDT 2001 | nifhail

How do you guys monitor your feeder's history/record. Is there any database available in the market to keep track feeders in your line such as caliration's due date, last calibration dates etc. ( basically the historical data for individual tracking)

Scored Printed Circuit Boards

Electronics Forum | Thu Jul 26 17:38:02 EDT 2001 | Russ Cutler

We are looking into using Scored PWB's on a new high volume design. We've used Tab Routed PWB's exclusively in the past. I understand that Scored PWB's are more efficient to produce and depanelize. Question: What are the industry standards for cr

Re: Defects Definition

Electronics Forum | Mon Feb 07 13:40:41 EST 2000 | Dave F

Jose: Those are good guesses. Without knowing more, ask yourself: 1 There is probably adequate heat available, but that portion of the substrate that�s not soldering well is not receiving proper heating. Why is the component getting so hot, relati


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