Electronics Forum | Tue May 21 13:17:47 EDT 2019 | SMTA-Thomas
2.54 μm [100 μin] gold thickness and all through-hole leads that will be hand soldered regardless of gold thickness” (we automatically solder wash all components which violate this requirement). In all cases we have attempted different no clean flux
Electronics Forum | Wed Oct 23 02:45:17 EDT 2019 | maxwilko
Hello there, My 'MyChronic MyData My500 Solder Jet printer' keeps having the same issue and I am unable to solve the issue. Suction flow too low: Check filter box and suction holes are clear. This problem would usually be solved by a new filter bo
Electronics Forum | Fri Dec 18 22:20:41 EST 1998 | phillip hunter
| I have developing a BGA Process and having problems with | 310 IO PBGA reflowing. I am achieving good wetting exept | 2 to 5 balls on the outer perimeter I have a good profile | my air flow is set per mfg spec, the stange thing is that | it doe
Electronics Forum | Sun Dec 20 20:40:22 EST 1998 | Miguel Mariscal
I would love to send a copy of my profile thanks, our machine is also a Summit 2000. | | I have developing a BGA Process and having problems with | | 310 IO PBGA reflowing. I am achieving good wetting exept | | 2 to 5 balls on the outer perimeter
Electronics Forum | Mon Jun 23 04:00:43 EDT 2003 | Paul Cooper
Hi there There are a number of things worth considering when viewing bga's. Firstly, like any other solder joint that you have been inspecting for years, suface finish is critical. Secondly, and again like other joints shape is important. Now it may
Electronics Forum | Sun Aug 15 11:02:37 EDT 1999 | Jeff Ferry
| Ladies and Gentlemen, | | As a newly appointed DFM/CE "guru" here, one of my responsibilities has become repair (of course). As I have some knowledge of BGA repair/rework using semi-automated equipment, it naturally follows I would hav tremendous
Electronics Forum | Mon Jul 26 05:02:33 EDT 1999 | Wolfgang Busko
| | We are going to smt ic's on the component side of our pcb's. | | The problem is we are going to have to do this by hand. | | We have a hot air station and vac pencil, but How reliable is this process. | | We've tried it on proto's and had some sh
Electronics Forum | Mon May 31 21:50:59 EDT 1999 | Dave F
| | I have always thought it to be a good practice to wash SMA's with water soluble paste (WS609) soon after reflow. Is there a time limit as to how long a board should sit after reflow before washing said board? For instance; processing a double-
Electronics Forum | Thu Apr 19 08:50:38 EDT 2007 | rgduval
Welcome to RoHS. Or, at least, to the version of RoHS that I've had to deal with since I started with my current company. Blowholes and pinholes seem to be common in PB-free manufacturing. At least, they have for me here. I also note that IPC has
Electronics Forum | Tue May 26 20:18:09 EDT 1998 | Justin Medernach
| | | | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and
