Electronics Forum | Tue Sep 08 22:50:10 EDT 2009 | leadthree
I am interested to learn what software you use to handle BOMs. So far we just use static Excel sheets, so different BOMs are not connected. I wonder what other companies use. I was looking into some GPL licensed (means free) packages, but most are E
Electronics Forum | Thu Jun 17 12:32:25 EDT 2010 | floydf
Last July I posted a query about reflowing leaded > paste to gold plated boards, I wasn't getting a > good reflow. The answer that seemed to work was > dwelling the board at reflow for the maximum > recommended amount of time. Would anyone have a
Electronics Forum | Mon Jul 21 06:18:15 EDT 2014 | digar
We had this. The anti-backlash nuts were binding. > We took them apart, chased the threads with a tap > and re-assembled with slightly less pre-load. > Hasn't been a problem since. > We had this. The anti-backlash nuts were binding. > We took t
Electronics Forum | Tue Sep 15 14:11:59 EDT 2015 | jpal
You should also remove all the pump parts and clean them, checking the bearings and seals. Clean completely the parts that allow the solder to flow back into the pot; ours have a spiral that fills with dross. Treat yourself to new nozzles. Tinning
Electronics Forum | Fri Aug 10 10:02:09 EDT 2018 | dleeper
In my opinion the SMT net admins do a good job swatting the spam when it pops up. I would be hesitant to change anything. We have a lot of vendor reps, and people with a commercial interest who still manage to provide valuable content on the forum.
Electronics Forum | Tue Jul 18 16:49:49 EDT 2023 | mahasg
Hello All, I am PhD student at polytechnique Montreal. We have a CQFP44 packages and Dies of 51um pad pitch (22nm FDSOI tech) that I need to bond myself at the university using ASM Eagle Xtreme gold wire bonder in the university. we need to perform b
Electronics Forum | Tue Mar 14 05:02:35 EST 2000 | emmanuel
I am to implement PBGA, and i am looking for PCB surface finish informations. A lot of technical reports are specifing NiAu finishing because of flatness property. Because of leads shape, I though that BGA doesn't need flat pads like QFP. Is it false
Electronics Forum | Mon Mar 13 15:10:52 EST 2000 | Stuart Adams
Assuming agressive design rules what is the minimum distance I can get away with between the board edge and a SMT pad and between the board edge and a plated mounting hole ??? (The board is only 1"x2" and the mounting holes are 80 mil dia, 125 mil
Electronics Forum | Mon Mar 13 15:35:32 EST 2000 | Ioan
Stu, it is good you know that there are limitations and you want everything. Wish our designers work like that. So, the limitations we impose are dictated by the rails of the insertion and dispensing machines. Normally a .150" keepout will make a s
Electronics Forum | Mon Mar 13 08:59:20 EST 2000 | Ashok Dhawan
I could not find a specific clause or section in J-STD-001B which can relates to special requirements in storage, packing and handling of Moisture sensitive devices per J-Std-033 / 786A /-022 . I guess the way ESD is relevant to electronics assemb
