Electronics Forum | Sat May 27 14:13:35 EDT 2000 | Madan Mohan
Hi Has anyone tried rework of lead-free assemblies? Any issues? Is there a solution for achieving high temperatures without adversely affecting board and component, considering the fact that higher temperatures are needed in rework machine compare
Electronics Forum | Sat May 27 14:09:23 EDT 2000 | do ngoc hung
MAY YOU HELP ME TO SOVLE THE PROBLEMS IN MACHINE. I CAN NOT CHECK NOZZLES IN CENTER, BRIGHTNESS MODE OR THE CCD CAMERA CAN NOT CAPTURE THE NOZZLES. SO MAY I HAVE ANY INFO ABOUT IT. PLS GIVE ME A ADVICE ASAP VIA EMAIL. THANKS AND BEST REGARDS. DO
Electronics Forum | Sat May 27 08:58:07 EDT 2000 | Thanas
Hi, I'm new in SMT & confusing to define the soldering defect criteria of cold solder, dry joint & dewetting. & what's the root cause for them ? FYI, I had read the IPC-A-610 rev. B , but doesn't help much. Any advise is very much appreciate. Thanks
Electronics Forum | Tue May 30 20:56:27 EDT 2000 | Dave F
Chua: No AI on SMT troubleshooting that I'm aware of. Don't dispare though, we're here to help you. Consider checking the SMTnet archives. There is a bountiful amount of information there. Good luck. And we hope over time that the burden of hav
Electronics Forum | Mon Jun 05 10:32:39 EDT 2000 | Khalid Saeed
It could be a gold finish problem. The recommened gold finish thickness is less than five micro inches. Gold thickness greater than five microi inches is significant contributor for causing embrittlement of the solder joints. Verify the reflow profil
Electronics Forum | Wed May 31 09:49:16 EDT 2000 | Brian
Your message comes at an interesting time. We are currently developing a more robust search engine for the entire site. One of the features it will have is the ability to display a user specified amount of results per page as well as the ability to
Electronics Forum | Thu May 25 21:38:06 EDT 2000 | Dave F
Roni: IPC won't help you. There is no standard. Consider your supplier and all your friends at SMTnet as the only things that will allow you to keep hold of that slender thread that you hold while twisting in the breeze. If you didn't have them b
Electronics Forum | Fri May 26 05:49:09 EDT 2000 | Richard Wilders
1.67. A lower accuracy will result in many off-pad flipchips; this means a lot of displacements. And there is no chance at all the flipchip will self-center back to the correct placement spot. I think you'll have to evaluate machinery that is capabl
Electronics Forum | Wed May 24 11:35:15 EDT 2000 | Bill Ng
Could someone help to let me know when we are doing stencil printing of solder paste on board with OSP surface finish on the land, the stencil is resting on the solder mask or the land itself. If it is resting on the solder mask, then, the actual pas
Electronics Forum | Wed May 24 12:15:53 EDT 2000 | Wolfgang Busko
Bill, I would assume that the stencil rests on the soldermask especially when you use a metallblade. If you know the difference in height between soldermask and land you could take that into your volume calculation when figuring out your desired ste
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