Electronics Forum | Wed Apr 26 06:43:21 EDT 2000 | Sal
Guys We currently produce a number of PCB's which are reflowed on the top side and glued on the bottom side, and the current process is to build the top side and reflow then glue and cure, is this approach correct ? or should we be curing then reflow
Electronics Forum | Wed Apr 26 10:59:54 EDT 2000 | Jose Baez
Sal: You are Correct running firts the reflow side then glue side. In my Experience I've seen a reverse procesess( first glue"cure" and then reflow side) but the quality results were not good, because We realized the Glue tent to cristalise and when
Electronics Forum | Wed Apr 26 11:50:18 EDT 2000 | Wolfgang Busko
Hi Sal, the way you do it has IMO some advantages: - no sophisticated support for the topside print - no extra thermal stress for the the bottomside bonding material - less possibilities to lose bottomside components by handling One disadvantage mig
Electronics Forum | Mon May 01 17:12:42 EDT 2000 | Joe
I have the same equipment and the same chemicals and have had the same problem. The part of the stencil which is glued to the mesh is being destroyed by the ultra sonics in the equipment. The only solution I found is to seal the glued part of the ste
Electronics Forum | Sat Apr 22 13:54:02 EDT 2000 | JAX
What's Up Big Man, Although I agree with a few things Dean said, personally I like back-light. But since you probably won't listen to me here's is the suggested info: Lead_check area= 60% Vision type= 120 P_pattern= 34 This rest is part dependant
Electronics Forum | Fri Apr 21 12:43:51 EDT 2000 | David
We are going to hand place through hole connectors by screening them top side in a double sided reflow board. I saw this done before sucessfully on a daily basis but is there anyone with a paper or specs as to what aperture size, any special pad cons
Electronics Forum | Thu Apr 20 00:53:23 EDT 2000 | Wister
Hi,Dave The "skip" wouldn't happened because we monitor the solder paste height every two hours.The open position is between chip terminal and the solder paste.one terminal lift a little not as same as tombstone.I suspect the activity of solder paste
Electronics Forum | Fri Apr 14 20:43:12 EDT 2000 | Mario J. Gislao
Mr. Mohan, I would suggest contacting OK International's Applications Engineering department directly. They are a world-recognized leader in providing BGA/CSP rework solutions and have one of the best rework machines on the market. Try contacting
Electronics Forum | Thu Apr 20 13:02:44 EDT 2000 | Robert Patrick
Hi.... I read your message and can empathize. I just joined PDR Infrared Systems. PDR offers an Infrared System for CSP/UBGA with X-Ray or Optical Inspection Packages. You may want to consider IR technology for UBGA before taking the plunge. Hop
Electronics Forum | Thu Apr 13 13:02:03 EDT 2000 | Paul Peterson
Hi fellow problem solvers,... We suspect a planarity problem with our 6 mil wide flex circuit pads having height variance of up to 2 mils after print and reflow. This is contributing to a placement skew with our TAB bonder... Has anyone had any succe
