Electronics Forum: assembler (Page 386 of 598)

un-tested assembled circuit reject rates

Electronics Forum | Tue Dec 07 13:40:25 EST 1999 | Tim

The company I represent provides electronic manufacturing services. Some of my customers ask that we ship their boards "un-tested". By un-tested I mean we build them, visually inspect them and out they go. I find that on un-tested boards, it's not

Re: Via Sizes

Electronics Forum | Thu Nov 25 21:43:49 EST 1999 | cklau

Via is normally a plated thru holes in (0.63 to 1.0 mm (0.025" to 0.040") diameter lands , which unless properly treated they must be located away from the component lands to prevent the solder migration off the component land during reflow soldering

Re: AOI

Electronics Forum | Mon Nov 22 11:16:04 EST 1999 | Boca

Chris, Some ramblings- Your choice depends on factors like which defects you're looking for, bugdet, quality inspection philosophy, high or low mix environment, sample sizes or 100%, and so on. Are you going to test 100% of the product coming off t

Re: Mil-P-28809

Electronics Forum | Fri Oct 08 02:19:01 EDT 1999 | Brian

| Is anyone aware of a web page for military spec's? I am looking for Mil-P-28809. | | Thanks, | Mike Demos | MIL-P-28809 is definitely obsolete. Not only obsolete, it was possibly the most scientifically flawed standard ever to to be printed. I

Re: Losing parts in wave

Electronics Forum | Tue Oct 05 18:37:19 EDT 1999 | Morris

| I hope that someone can help me with my problem! I am experiencing a lot of glued on parts falling off in the wave solder machine. A little information about my process: 1)We use Loctite 3609 glue that is used up long before its shelf life 2)Our

Re: Losing parts in wave

Electronics Forum | Wed Oct 06 08:55:23 EDT 1999 | Brian Conner

| | I hope that someone can help me with my problem! I am experiencing a lot of glued on parts falling off in the wave solder machine. A little information about my process: 1)We use Loctite 3609 glue that is used up long before its shelf life 2)Ou

Re: 0402 part identification

Electronics Forum | Wed Oct 06 09:23:47 EDT 1999 | Wolfgang Busko

| I would like comments on how the industry handles 0402 parts, regarding identification. Since the parts are too small to be labeled, how can we accurately identify the parts and or values, either before or after assembly? | When the boards go to te

Re: Digital Camera

Electronics Forum | Mon Aug 23 17:49:09 EDT 1999 | John Thorup

| This is out of the normal scope of this site but� | | I am in search of a Digital Camera for use with documentation instructions. What would be the Minimum Resolution that I should require? I will need details of assemblies such as Component Ide

Re: Parylene Coating of Plastic Parts

Electronics Forum | Thu Aug 05 06:58:04 EDT 1999 | Graham Naisbitt

| | | Has anyone out there tried to parylene coat plastic parts prior to soldering them to a pcb? I'm looking at several potential applications where fewer than 5% of my components on a pcb are plastic, yet from a reliability aspect (environmental co

Re: Bare Copper Pad Reflow Soldering

Electronics Forum | Fri Jul 30 14:50:26 EDT 1999 | Kevin Hussey

| I received a request from customer to assemble ceramic substrate (alumina oxide)that printed with a low temperature Copper thick film conductor (the overglaze layer is polymer). The Copper pads are exposed without any coating. | This ceramic substr


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