Electronics Forum: after (Page 388 of 696)

Gluing Quality Issue !!!

Electronics Forum | Thu Nov 05 03:40:34 EST 2009 | valeo

Hi Rajeshmara, Mail sent with the datasheet of the glue we use in production. Thanks for first information you provide me for the shear specifications on 1206. But can you be more precise on this point ? How did you define it ? Is anyone have more

BGA Solderability Issue

Electronics Forum | Tue Nov 17 22:36:17 EST 2009 | rajeshwara

Hi All Plz help , we are manufacturer of Set Top Boxes , where we use ST BGA 5202 ,Paste : ALPHA METAL OM338-T45-LF & STENCIL : 4 MIL & we also tried 5 mil . Problem : At first Test BGA work fine but after some days Assembly dead functional and when

Bubbles on solder joint(after conformal coating curing)

Electronics Forum | Tue Nov 24 05:23:18 EST 2009 | prodivegsr

Hi Davef, Thanks...Saw 1 of your thread that you posted : Thanks for providing... From davef : There are many possibilities: * Conformal coat is incompatible with surface residue on the board * Conformal coat is incompatible with solder mask on the

Bubbles on solder joint(after conformal coating curing)

Electronics Forum | Wed Dec 02 10:14:42 EST 2009 | duso02

As a large coating house we use 1B73 daily and we have very few issues with bubbles. We very rarely bake it as the air cure is so short. Also, we only use thinner 73 vice 521. Another question would be; how is it being applied? How thick are you appl

Bubbles on solder joint(after conformal coating curing)

Electronics Forum | Wed Dec 02 20:11:37 EST 2009 | prodivegsr

Hi Lou, we are using a fluid dispensing machine. our current requirement is around 50um. From the Datasheet,the thinner 73 has a higher evaporation rate of 1.0 comapring with thinner 521 at 0.6... does the higher evaporation rate eliminate the bu

Lead Free solder

Electronics Forum | Thu Nov 19 20:05:14 EST 2009 | davef

Density. There is a difference between lead (.410 lbs. per cubic inch) and tin (.254 lbs. per cubic inch). The same volume of tin-based solder, therefore, weighs approximately 1/4 less than a lead-based material. This adds up to more joints per pound

Circuit cam?

Electronics Forum | Thu Dec 24 09:30:56 EST 2009 | fishingfool

Looking for an answer about file structure on CC. It has been 10 years since I have done anything with CC so bear with me. After you have created a job file that has all the components on it and the polarity parts have a pin 1 indicator, I need to

Via Failure in Field

Electronics Forum | Wed Jan 06 01:43:27 EST 2010 | oddbudman

Hello, we have recently had some products returned (they were installed and operating in the field for around 2 months before they were returned). After looking at the boards it seems the vias have failed. We now have 2 pc pcbs with the same Via fa

Assembleon / Philips support. Ask your question.

Electronics Forum | Tue Jan 12 14:19:23 EST 2010 | deltaservices

Hello Andrew, For programming a single Topaz or Emerald you need only the Cad2cad 1.5 (Freeware) With this program you can generate a VIOS.TXT file based on your position data. You import this in the machine and add your component and Fiducial d

Solder briding on QFP

Electronics Forum | Sun Apr 04 00:51:01 EDT 2010 | jmelson

On the Xilinx chips, I am pretty sure these hairs are NOT tin whiskers. The solder in this particular build was SnPb, and pure tin would almost certainly melt at soldering iron temperatures. My theory is that slivers of the lead frame material, lik


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