Electronics Forum: mani (Page 397 of 496)

SPC on SMT

Electronics Forum | Fri Nov 23 14:47:35 EST 2001 | kgroen

Some comments on the previous post: Be careful when looking at the proportion of SMT defects that are solder defects - you may very well find that only a small few of them originate at the screen printing step. As for specification limits for pas

Student Needs Help With Choosing Degree

Electronics Forum | Wed Nov 28 20:14:50 EST 2001 | ianchan

Hi, i'd second that choice of enineering degree in electronics as monkey says, coz of variable options open to you IF you decide to rotate in your field of applicable enggr interests... IT courses are abundant in today's "open Uni" learning "econom

Solder Paste Printed Volume

Electronics Forum | Mon Nov 26 14:49:20 EST 2001 | mparker

1. The formula for cubic area (LxWxH) applies to get the expected volume target value. Caution- do not assume the pad surface square are is correct for the part. Do consider the footprint of the device beign placed and its solder requirements to cre

artistic performances with electronic clothes

Electronics Forum | Tue Dec 11 04:43:35 EST 2001 | maubrey

I am the director of a performance/art group who work with electroacoustic clothing. Esssentially we perform with electronic clothes that make sounds by react with/to the environment. Please take a look mat our web site (complete wi

soldering and bonding on gold PCB's

Electronics Forum | Wed Jan 09 12:20:00 EST 2002 | mregalia

Thanks for cluing me into IPC-2221. Though the numbers they give seem to contradict what I have learned from people working with the materials. At least I now know where the guideline for a max of 30 microinches of gold for soldering comes from. But

SMT Line Test

Electronics Forum | Wed Jan 16 20:08:48 EST 2002 | davef

Comments are: * Some people use calibrated boards and components to remove sources of variation when using their CMM to measure placement accuracy. Sources of supply are listed in the fine SMTnet Archives. * It�s unclear that a single board will mee

ScanPlace or any scanner cad package

Electronics Forum | Thu Jan 17 18:29:01 EST 2002 | Bill Loving

Dear Jason, Thank you for posting your request on SMTNET. Please note that ScanCAD International provides an upgrade path for all installed customers, regardless of the age of their system. Currently, hundreds of systems are installed in 37 countr

ScanPlace or any scanner cad package

Electronics Forum | Thu Jan 17 18:33:24 EST 2002 | Bill Loving

Dear Jason, Thank you for posting your request on SMTNET. Please note that ScanCAD International provides an upgrade path for all installed customers, regardless of the age of their system. Currently, hundreds of systems are installed in 37 countr

BGA Via Plugging

Electronics Forum | Thu Feb 07 20:53:51 EST 2002 | davef

Regardless of the technique used for the mounting pad shape or definition, isolation of the plated through hole [PTH] from the mounting pad is important. If the PTH is contained within the mounting pad, solder will wick down the PTH. The amount of

Solder Paste Inspection System.

Electronics Forum | Wed Mar 06 17:15:06 EST 2002 | djarvis

Hmmmm, very good point. I never thought about it much as such dedicated tools were not available when I first kicked off. I'd look at the reflow under a microscope and if I could identify any problems, I'd start to look at the print using the same


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