Electronics Forum | Thu Aug 23 15:43:24 EDT 2001 | mparker
Have you considered vacuum package in ESD bags, just like the way the IC's are packaged? What about conformal coating for the units being stored? 10 years is a long time for End of Service life of a product. You may need to get accelerated life testi
Electronics Forum | Thu Aug 23 13:29:07 EDT 2001 | morefun
Some of our other divisions have had to do epoxy underfill with BGA devices to obtain adequate reliability for aerospace applications. Are there any special layout considerations required to ensure that we can do underfill if we deem it necessary du
Electronics Forum | Thu Aug 23 20:31:53 EDT 2001 | davef
We never underfill BGA, but then again our products are not blasted into space. Certainly you need to provide enough room for the dispense head to move around the component in the pattern appropriate for the underfill you plan to use. Probably more
Electronics Forum | Thu Aug 23 16:01:59 EDT 2001 | Steve
You made the statement "The rest of the board we use them on looks great..." My question is, what's the difference between the assemblies? Mass? Solder? Oven? Are the boards the same thickness, are other parts causing heat sinking, etc. The reflow m
Electronics Forum | Fri Aug 24 07:49:37 EDT 2001 | caldon
Depending on how old your through hole equipment is it should be SMEMA compatible. A copy of the SMEMA wiring diagram and protocalls can be down loaded from the IPC web site Under downloadable Doccuments SMEMA Standards. SMEMA : http://www.ipc.org/ht
Electronics Forum | Fri Aug 24 11:31:59 EDT 2001 | Stefan
Are you saying that the sensor is mounted onto the output conveyor of the glue machine and wired into the Onserter? If so ( weird, because the glue machine should have a SMEMA interface ), than you could mount the sensor on the input conveyor of the
Electronics Forum | Fri Aug 24 18:00:23 EDT 2001 | Marshall
Hi, I understand that solder joint shape and strentgth is dictated by land dimension / geometries. i have a pcb with 4-5 different land dimensions. My queries are: a) since all of them were tested, what will be the effect if I leave it that way whi
Electronics Forum | Mon Aug 27 11:01:05 EDT 2001 | lloyd
Hi, I'm currently looking into changing our current supplier of SMD adhesive. My problem is how to effectivly evaluate any new samples I recieve. I'ved looked through the IPC standards and understand the concepts in testing them, but in practical te
Electronics Forum | Tue Nov 27 10:56:42 EST 2001 | jmathis
Hello, Our company has been successfully using Loctite 3612 for screen printing glue. Resently there has been a HUGE issue with the melf components falling off or tumbstoning during the wave process. It's apparent that these components were cured
Electronics Forum | Tue Nov 27 19:42:58 EST 2001 | mparker
Dave - will placing MELF's in SMT eliminate the original problem? Is the flux aggressive enough to clean mold release agents from the component manufacturer? Good point about LT reliability, just wondering what would happen if glue was eliminated fr
