Electronics Forum | Fri May 26 09:49:34 EDT 2006 | pjc
This question cannot really be answered definitively here. There are unknowns such as your board design and solder land finish. I suggest you conduct a DoE (Design of Experiments) to determine paste print deposition X-Y-Theta tolerance for your appli
Electronics Forum | Fri Jun 16 08:45:35 EDT 2006 | Chunks
It's hard to say since cleanliness on my product may be acceptable, but may fail on yours. If you really are worried about flux residues, or need to pass some cleanliness spec, you may want to look into water soluable. Otherwise, most of the name b
Electronics Forum | Thu Jun 15 17:59:28 EDT 2006 | slthomas
I have in the past had lots of problems with soldering film caps (same problems as you), but that was mostly before the manufacturer redesigned them. Profiles and changes in paste netted some improvements but it really took changes at their end to re
Electronics Forum | Mon Jul 24 11:35:42 EDT 2006 | Jimk@ics-inc.org
We have experienced a problem with tin leaching or discoloration of lead terminals on random parts on solder side of a paste/paste operation. The profile has been used on previous production runs and there doesn't appear to be any heat damage to othe
Electronics Forum | Fri Nov 24 06:59:54 EST 2006 | LM
I remember many moons ago seeing a refridgerator for storing solder paste which issued them out in a FIFO manner and had the option of a PC and bar code scanner for logging them in and out to the lines. I can't seem to find any trace of it on the net
Electronics Forum | Mon Jan 22 02:35:57 EST 2007 | AR
Thanks for the info everybody. As Real Chunks stated, a lot of paste is needed in order to solder the clinched part of the lead on to the pad. It can be done with a dispenser but it takes a lot of time. The good part is that the result looks surpris
Electronics Forum | Wed Apr 25 09:57:24 EDT 2007 | patrickbruneel
Here�s the link to the exempt request, the exempt is for �solder paste� nothing is stated about plating. http://forum.europa.eu.int/Public/irc/env/dir_2002_95/library?l=/requests_exempions/resonator_electronics/a-1018_swatchpdf/_IT_1.0_&a=d If you
Electronics Forum | Mon Feb 11 17:21:40 EST 2008 | larryd
What causes BGA voids over 25%? Have recommended profile for solder paste, hit 237C for 5 seconds and still get a void on 2% of specific BGA in various locations. BGA is FG676, 1mm pitch, on ImAg using lead free paste OM338 on a 6 layer FR4 PCB.
Electronics Forum | Mon Feb 18 02:08:06 EST 2008 | lococost
4 days seems a lot. You could be losing flux activation causing poor wetting on the enig. Check your suppliers data sheets for paste life. If it was contamination on the PCB, you'ld expect other components to solder badly as well. Try using a bra
Electronics Forum | Sun Feb 24 10:15:41 EST 2008 | teamcanada
Issue cross talk \Stencil thickness recommendation? 3-4-5 mil Using manufactures recommended paste layout Water soluable vs No clean Paste. Any recommended publications? Only one found so far is Fairchild, recommend NC due to potential cleaning issue
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