Electronics Forum | Mon Nov 27 15:42:00 EST 2000 | rabell
Of course recognize off the top that I have a certain bias :-) - and the choices are somewhat limited if you are looking for off-the-shelf product. There is also NO independent agency that I know of (i.e. an electronic training "Consumers Report")
Electronics Forum | Mon Jun 11 22:06:00 EDT 2001 | davef
The issue is not the cleanliness of your in-bound water. The issue is the cleanliness of the board your customer receives. Look at J-STD-001C, Para 8, "Cleanliness Requirements". The end product cleanliness is the end result of your: * In-bound
Electronics Forum | Tue Jun 12 18:06:17 EDT 2001 | davef
The criterion you use will depend on the test method you select. For minimum requirements, look at J-STD-001C, Para 8, "Cleanliness Requirements". I figure that you�d measure the residues on a lot of your current product, measure the res on a lot o
Electronics Forum | Tue Jun 26 19:51:31 EDT 2001 | davef
Rosin. A hard, natural resin, consisting of abietic acid [and pimaric acids in Europe] and their isomers, some fatty acids, and terepene hydrocarbons. Rosin is extracted from pine tree stumps. It�s an organic material distilled from oleoresin in p
Electronics Forum | Mon Jun 25 20:37:14 EDT 2001 | davef
You are 100% correctamundo that the pad on PCB should be the same as the pad on the BGA interposer, but let�s not expend that thinking to the aperture of your solder paste stencil, right away. Generally, paste on large pitch BGA is often 1:1, but as
Electronics Forum | Sat Jun 30 11:28:24 EDT 2001 | davef
Consider using a roll solder with a flux that well matches the residues you can accept to be remaining on the board when you get finished processing. Many people use a no-clean flux cored roll solder for such operations, because they don't want to c
Electronics Forum | Thu Jul 05 19:39:19 EDT 2001 | davef
I had forgotten that it was you that was on the Sipad adventure. [But then again, who can keep track of yer aliases? ;-)] You just go from one adventure to the next. Expanding On Dave�s Hi-Test Flux Method Theory � PASTE: Yes, contact your favorit
Electronics Forum | Mon Jul 16 21:25:26 EDT 2001 | davef
Sure, use of U-shape apertures is another way to reduce the amount of paste that you apply. That and similar schemes mentioned in the article are not a function of the flux used. We have used U-shaped apertures for MELF and mini-MELF. They are sug
Electronics Forum | Tue Jul 17 12:03:29 EDT 2001 | mriddle
I am the director of sales & marketing for ASC International. I am concerned by the remark that "ASC has perculiar business practices, that worry would-be-buyers of their machine(s)...." Please elaborate so that we can act swiftly to correct any unf
Electronics Forum | Fri Aug 03 17:00:57 EDT 2001 | mparker
Start with a definition of what you expect the AOI to achieve at each station. Will your in-line machine be post print? Place (pre-reflow) or post reflow? Rather than buy one very expensive machine to put at the end of the line, maybe a couple of
