Electronics Forum | Mon Dec 02 17:02:28 EST 2002 | Vince Whipple
Steve, I agree with the recommendation to check the temperature. This is the first place to go. Is this an IPA or water based Noclean? What is the topside temp of the assembly at the effected areas? If you are too cold you will have a tendency to hav
Electronics Forum | Tue Dec 03 11:59:01 EST 2002 | slthomas
We haven't run a profile yet....probably because we're a-feared to. We can't do topside preheating here to any degree because we use an aluminum plate for aligning hundreds of top side through-hole components (pots, switches, buttons, LEDs) that te
Electronics Forum | Wed Dec 04 09:24:52 EST 2002 | jseagle
I have found that preheating the solder pallets prior to use helps cut down on the solder balling. Also, we do not cool the pallets between passes and we use a spray fluxer because a hot pallet will knock down the head on a foam fluxer. We use WS f
Electronics Forum | Mon Dec 02 21:32:34 EST 2002 | davef
Sounds like you're killing the poor little critters. Tell us about: * Placement force. * Reflow method. * Where and how you are measuring your reflow recipe. * Cooling rate of the reflow recipe. * How the solder connection to the metalization appear
Electronics Forum | Tue Dec 03 15:55:05 EST 2002 | dpaluck
I have some files from the 1980's that I need to convert to Gerber. Some contain ASCII and some don't. There is a reference to Personal CAD Systems, Inc., PC-CAPS and PC-CARDS. Can anyone convert this or tell me if software is available to do it?
Electronics Forum | Thu Dec 05 15:06:53 EST 2002 | cbudzinski
HI can anyone tell me if they ask there board houses to hold to a max amount of contamination NaCl per sq /in on there incomming bare boards, I have a Ionograph 500SMD and have been testing some of the bare boards comming in to stock, some are much
Electronics Forum | Thu Dec 05 17:45:31 EST 2002 | Gris
Hi, Is the limit for " 10.07 " for assemblies ? I guess we need to calculate how much ionic residue the boards see after assembly and cleaning. and then calculate back to the board spec if i am not mistaken ? For bare fabs we have to access the li
Electronics Forum | Thu Dec 05 22:46:39 EST 2002 | davef
While J-STD-001 specifies an upper limit for acceptance of assembly, we use Resistivity Of Solvent Extract testing as a process control. In truth, this "LT 10.07 �gm/sg in NaCl equivalent" measurement has substantial limitations, not the least of wh
Electronics Forum | Mon Dec 09 08:13:06 EST 2002 | MA/NY DDave
Hi Yes it is common to design for more uniform heat transfer during the soldering phase or even during the operation phase. It all depends on how bad the problem is during automated assembly or during usage. The only difficulty is that the designer
Electronics Forum | Tue Dec 17 08:55:52 EST 2002 | Randy Villeneuve
Grant, The board maybe the problem but how is your oven working? Is it a convection oven and how many zones (top and bottom)? What does your profile look like? If you are unsure and if you only have one oven, send your board to Soltec or Electrovert
