Electronics Forum: 2000 (Page 409 of 505)

microprocessor project

Electronics Forum | Thu Sep 07 12:42:53 EDT 2000 | Vincent Geesing

Hi, my name is Vincent Geesing. I�m a student computer engineering in the Netherlands. We (me and 3 other guys) are developing a motorized car who can find his way himself. The car must go straight and avoid some obstacles on his way. It drives in a

Re: IPC Land Pattern Vs Manufacturer's Recommendation

Electronics Forum | Wed Sep 06 09:06:05 EDT 2000 | Wolfgang Busko

Randy: Seems you have a long way to go to DFM. To your strategy: - proof that in the case of wrong landpattern design the IPC would have been the better choice - count money ( what�s the cost of redesigns due to bad landpatterns ) - establish at leas

Re: IPC Land Pattern Vs Manufacturer's Recommendation

Electronics Forum | Wed Sep 06 20:31:10 EDT 2000 | Dave F

Randy: My druthers on sources for SMT land patterns, in decreasing preference order are: 1 Manufacturers' recommendations. The problem with manfacturers' recommendations is that someone must make the effort to obtain them, document, and use them.

Re: After PCB CLEANING with acqueous , drying needs?

Electronics Forum | Tue Sep 05 16:04:43 EDT 2000 | Dave F

Pascal: Responding to your questions: 1 Do we have to dry the PCB after cleaning (sic)? Generally, nothing says you have dry the PCB after aqueous cleaning. Along this line, I received several thoughtful responses when I posted a similar thread.

CuOSP and IMM Silver versus HASL

Electronics Forum | Thu Aug 31 12:17:56 EDT 2000 | mike weekes

We are considering alternative Board Finishes to our existing HASL process. The HASL effects opens on 25 and 20 mil packages after reflow and we know if the advantages of CuOSP and other alternatives. OUR Concern: Is there a shelf life and handlin

Ceramic case resonators falling to pieces after reflow soldering.

Electronics Forum | Wed Aug 30 00:16:15 EDT 2000 | Craig

We are reflowing ceramic resonators and are finding their tops falling/popping off when handling the pcbs during final assy. The epoxy seems to be coming off the components base and adherring to the lid. The components are "RFM resonators", case type

PCB snap-offs

Electronics Forum | Tue Aug 29 10:44:01 EDT 2000 | Dougie

Hi, This a dull question I know, but I have a boss who want's an answer... PCB snap-offs: * Design keep them to a minimun to save cost on the PCB * Production want more to stabilise the board when it goes through the process as some PCBs partially

Re: PCB snap-offs

Electronics Forum | Thu Aug 31 04:25:03 EDT 2000 | Chris May

Dougie, If you have square, rectangular etc; shaped PCB's maybe you could have routing between circuits. "V" shaped grooves top and bottom. I found this extremely good especially if the assemblies are wave soldered. No gaps for flowing up and over.

0603's on 0805 pads

Electronics Forum | Mon Aug 28 17:54:59 EDT 2000 | Steve Thomas

We're trying out 0603 packages on some 0805 footprints (at this stage only on some test boards) since our vendor tells us the 0805's are going to be getting harder to get, and more expensive to pay for. I understand the IPC footprint for the two is

Re: no tru-hole on wave

Electronics Forum | Mon Aug 28 15:34:19 EDT 2000 | Steve Harshbarger

Hello Ramon, This is a very common problem that usually can be overcome. Can you tell me the flux type you are using (manufacturer, and flux number)? Has your board vendor, or type of PCB's changed (are they entec coated - bare copper)? What is t


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