Electronics Forum: employ (Page 5 of 26)

Re: Looking for feedback from our site users on the Career Center

Electronics Forum | Fri Feb 25 17:25:05 EST 2000 | Brandy Ford

Thank you for your response Michael- I agree with you completely. Though there are fields for the employer to fill out, they are not required fields. Should we make them required? What job that you are interested in that doesn�t have a location

Dealing with leadless chip carriers

Electronics Forum | Wed Feb 16 20:51:37 EST 2000 | Jim

We have to place some LCC208's. The terminations are flush with the underside of the package, on an 0.5mm pitch. The pads on the board are flat tin. We'd like to get the part up in the air a little to provide some clearance for cleaning. Is there a w

BGA vs. QFP Packaging.

Electronics Forum | Sat Nov 06 14:39:50 EST 1999 | Gary Moravchik

I am seeking sources of reliability and thermal stress data that compares BGA (50mil ball pitch) to QFP (20mil lead pitch)packaging for automative applications. Substrate material is epoxy glass. The ultimate goal is to collect sufficient data to hel

SMT productivity measurement

Electronics Forum | Thu Sep 09 00:57:42 EDT 1999 | Stoney Tsai

Currently, I have been requested to measure our SMT productity, capacity levels. I employed "pcs/day" as a base to come out with indicators for the top management decision-making. Anyone has other ideas to measure these two items? What are the lat

Re: SMT productivity measurement

Electronics Forum | Thu Sep 09 08:58:07 EDT 1999 | Dave F

| Currently, I have been requested to measure our SMT productity, capacity levels. I employed "pcs/day" as a base to come out with | indicators for the top management decision-making. Anyone has | other ideas to measure these two items? | | What

Re: Solder Paste Stencil specifications

Electronics Forum | Fri Jan 23 18:03:06 EST 1998 | Steve Gregory

Paul, I've got a third-level ISO Stencil Specification procedure that I did at a past employer that I'll send you...it also deals with the DEK-265 printer (which is what we used) when I talk about frame sizes and image positioning, but you can edit i

When do you use Tin/Lead/Silver paste ?

Electronics Forum | Wed Feb 20 10:28:38 EST 2002 | jax

Silver in paste is usually employed to prevent scavenging of silver from silver plated surfaces, BUT Dave's right. I wouldn't think Components are uniform enough to base a process change on. See how it goes with what you have. You will probably find

Master Assembly Document Control

Electronics Forum | Wed Mar 20 16:17:35 EST 2002 | Fuji Spares

Both My Employers and myself have bought Microsoft access custom designed database Applications from Technology Media, Bradford (www.tekno-media.com) The databases were for engineering change notes and also a customer returned goods data tracking pro

Contract manufactuer in China

Electronics Forum | Mon May 12 07:33:30 EDT 2003 | stefwitt

To my humble opinion it is more a political question than medical or SMT manufacturing. While the Flextronics and Solectrons consider re-locating their manufacturing into Polen, Hungary or Bulgaria, you may ask yourself, if you rather make a call wi

Health Screening For Lead

Electronics Forum | Tue Apr 15 14:56:53 EDT 2003 | blnorman

I know when I worked on a NASA site, anyone in the lab was given a free physical once a year. This way they could find out what employees were normally exposed to and could track any potential illnesses. What are the costs of a lawsuit when an empl


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