Electronics Forum: designing (Page 415 of 537)

General SMT Question

Electronics Forum | Thu Nov 20 17:52:30 EST 2008 | orian

Hello Im a uni student trying to find out information on SMT. Ive just spent around 2 hours searching for SMT information and can not find anything. More i spend time trying to figure out how, im starting to think, this is not something you can do

Damaged Components by Reflow Process (Process Window)

Electronics Forum | Wed Feb 04 09:58:50 EST 2009 | dyoungquist

As was stated before, you need to have oven temperatures (profile) set such that you get good solder joints with the paste you are using. And definately run a profiler through yor oven to verify it is working properly. As for components, most data

What Does This Thread Express Newsletter Have To Do With SMT?

Electronics Forum | Sun Feb 08 18:03:26 EST 2009 | davef

Roland What does this thread in the current issue of SMTnet Express newsletter have to do with SMT? Coating Drug-eluting Arterial Stents Using Ultrasonic Spray Nozzles One proven method used to treat clogged arteries employs tubular, mesh-like met

High complex board manufacturing

Electronics Forum | Tue Mar 03 03:02:17 EST 2009 | emmanueldavid

25% out of Lands in PCB, Insufficient/Inconsistent Alloy deposition which causes for poor Tackiness between Device Spheres & Paste deposited. Also note that Aperture Opening Designs in Your Stencil draws a huge role for these defects. 4. Placement: P

Unknown Reference Designator

Electronics Forum | Wed Mar 18 11:39:06 EDT 2009 | chrisgriffin

Greg, You guys are right, it was a thermistor. I believe the machine was powered up with the wrong voltage. Here is what gets damaged if the transformer is tapped for 230 and you apply 480: 1. Both CPU modules on the MX100 PLC's blown. 2. Both col

BGA ball vs land design problem??

Electronics Forum | Mon May 25 08:37:28 EDT 2009 | d0min0

Hello, recently we changed supplier of the LF BGA, we did corossection and now have doubts... previous BGA specs : pitch 1mm, ball diameter 0.6mm future BGA specs : pitch 1mm, ball diameter 0.4mm on the crossecrion we found that one of the ball seem

Crazing or Delam - Thermal or Mechanical?

Electronics Forum | Thu Jun 25 22:25:24 EDT 2009 | boardhouse

In the life of this product that you have been doing this process, has the material alway's been IT180 material? One problem with Lead free material is that it is more fragile that standard FR4 Epoxy laminate. And is known to have chipping or fractu

Electrically-Conductive Tapes application advice?

Electronics Forum | Sat Aug 01 04:45:43 EDT 2009 | hohk

Thanks on the advice isd.jwendell! Yes, the piezo ceramic has a Curie Temp of about 800C, so its safe operating temp should be around 300-400C. How about if my PCB is a prototype, would it be more economical to use hand soldering or just manually app

Electrically-Conductive Tapes application advice?

Electronics Forum | Sat Aug 01 22:29:14 EDT 2009 | hohk

Here's the link to the image. It seems the forum's image feature is down? X-section view.. http://i672.photobucket.com/albums/vv88/hohk/X-sectionView.jpg Copper Strip with Adhesive Tape idea... http://i672.photobucket.com/albums/vv88/hohk/CoperStri

Mysterious reflow problem

Electronics Forum | Mon Aug 31 07:56:39 EDT 2009 | d0min0

Hello, since some days we are facing strange problem with SMT component reflow paste on one side of the component is reflowed correctly while the other side is 10%-70% non-reflowed (same component on 3 positions per module, alwyas the same land pad)


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