Electronics Forum | Thu Jan 13 22:05:46 EST 2022 | mihai_voivod
-Thank you Thomas. In the past I have tried using a clip to hold it in place and it partially worked as a significant amount of connectors ended up shifted causing defects and necessitating rework. -I am going
Electronics Forum | Thu Jan 20 21:29:48 EST 2022 | stephendo
Copper gets etched in a photographic manner. ENIG is an additive process. Nickel gets added then gold gets added on top. Therefore it is not a matter of over etching. It is a matter of not enough gold added. The layer of gold ideally is as thin as po
Electronics Forum | Wed Mar 02 18:23:57 EST 2022 | proceng1
In my experience, take whatever the manufacturer tells you the minimum keep away area is and double that for standard use. I'm not saying it can't do what they say, but no matter how precise the software, the motor control, the lead screws and rails
Electronics Forum | Thu Mar 31 12:13:28 EDT 2022 | cbart
That is a tough one because of package size I agree, as noted previously it would be good to know what the current PCB pad layout is. first thought does go right to an adapter board of course! is this a volume build or just 20-50 pcs? dead bug and ha
Electronics Forum | Thu Apr 14 14:00:44 EDT 2022 | winston_one
Also at few boards we see excessive voiding, extremily excessive. During solderind some bubbling can be observed near the soldering point. Boards was dried before assembly. May be we have a problem with too thin metallisation - that's why poor adhesi
Electronics Forum | Mon Apr 18 12:14:39 EDT 2022 | proceng1
As far as hole fill, as was stated above, class 2 only requires 50% up-fill. In order to get better up-fill on the initial pass, you may need to consider more pre-heat. Also, better application of flux. Are you using a drop jet, or a spray? You
Electronics Forum | Thu Jun 09 20:16:28 EDT 2022 | llawrence
Hi, We are producing a board that contains an RN4678 bluetooth module, and an STLINK-V3MODS module, both of which are castellated modules. I am constantly having issues with the modules being soldered to the PCB incorrectly. It seems that the RN4678
Electronics Forum | Wed Nov 02 11:01:56 EDT 2022 | tommy_magyar
Ellaborating on Evtimov's answer: - solder paste type, think about solder granulation and viscosity. Both of these will directly affect print quality if wrong print parameters used. You will normally find recommended print parameters on the solder pa
Electronics Forum | Mon May 15 18:31:28 EDT 2023 | daniel_stanphill
I have found Superior No. 75 to be an absolute miracle worker when it comes to nozzle maintenance. I let our worst nozzles soak in that over the weekend and then the majority of the dross would literally flake off with light pressure from a pick/scre
Electronics Forum | Fri Jul 28 11:12:18 EDT 2023 | shrikant_borkar
Hi SimionR, Is Glue Process Dispencing or Glue Printing thru Stencil? if Its Dispencing Glue thru a Nozzle then its a controllable process. I have performed it thru HDP-3 Panasonic. Placement of Glue either one DOT or Process must be aligned with th
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