Electronics Forum | Tue Apr 03 13:28:11 EDT 2012 | davef
Is this related to this specific machine or this product? * Is this machine having a tough time regulating pot temperature? * Is this product dragging-out solder from the pot when it is being run so quickly? * Is this board out-gassing to create thes
Electronics Forum | Wed Jul 04 13:28:00 EDT 2012 | davef
Nice picture. What's that snot on the solder in the bottom left of the picture? I'd guess that this ribbon cable wants to be hot bar soldered.
Electronics Forum | Fri Aug 03 06:20:58 EDT 2012 | kahrpr
Absolutely! The Solder paste needs to be brought to room temperature or close before opening. It like bringing a cold glass from the refrigerator when the humidity is high,water will condensate on the glass. It also will condensate on the solder and
Electronics Forum | Thu Sep 13 18:00:35 EDT 2012 | mark25y2001
possible problem are loading orientation, solder flow cannot reach the pad portion due to trap of the body of the diode... or try to adjust turbulent but observe overflow... because turbulent are penetrate solder to pad and terminal of the diode. ho
Electronics Forum | Tue Sep 18 10:29:21 EDT 2012 | davef
Sorry. I don't see any solder balls. To me, it looks like the solder wetted the pad and then pulled back. It's called dewetting. It's a defect. Ask your supplier for a SEM analysis. I'm interested to know what he / she says.
Electronics Forum | Mon Oct 22 16:47:09 EDT 2012 | edmundo
We use a NC Flux in the wave solder and after aAcelerated Life Test cicle we found contamination white residues paths between some solder points. Does somebody know a possible cause for this contamination.
Electronics Forum | Thu Nov 29 14:11:33 EST 2012 | davef
When you say "solder paste layer," what are you talking about: * Post-print / pre-placement quality inspection * Post-reflow solder inspection * er what?
Electronics Forum | Wed Dec 05 11:11:30 EST 2012 | eniac
SAC305 - it's just a metal composition of solder paste. All properties of solder paste depend on chemical composition of flux and other components - I don't know their names in English, sorry.
Electronics Forum | Thu Jan 31 13:01:33 EST 2013 | kmots15
Defect if its not coated. Defect - Class 1,2,3 • Solder balls are not entrapped, encapsulated or attached or can become dislodged in the normal service environment. • Solder balls violate minimum electrical clearance.
Electronics Forum | Wed Mar 06 10:29:40 EST 2013 | sara_pcb
What is the minimum solder mask thickness required for Class 3 products. We are insisting fabricator of the pcb shop to use only spray coated solder mask. The SM thickness on the epoxy is about 17 microns, In the center of the tracks are 8 microns an
