Electronics Forum | Mon Apr 10 13:08:44 EDT 2006 | PWH
We are researching the purchase of a new or used BGA rework station. We need to rework various sizes/pitches of BGA's. Not sure on budget $'s - we will consider all options at this time. Our BGA volumes are fairly low. Any thoughts or recommendat
Electronics Forum | Mon Jun 26 17:51:17 EDT 2006 | russ
Just don't see it happening Bolos, aint gonoing to make up 3 bucks with BGA vs. QFP. Both packages from an assembly standpoint should be equal dollars. Why do you want BGA over QFP? Is it because you think your process will be better with BGA? Ru
Electronics Forum | Wed Oct 04 18:21:04 EDT 2006 | stepheniii
We have a board we run screwed to a fixture. There is no warping that way. If you go for reheating the BGA's make sure there is no time for the BGA's to absorb moisture.
Electronics Forum | Mon Aug 11 10:37:19 EDT 2008 | realchunks
I assume you mean the balls of the BGA, not pads (laugh it up guys - I said balls). If so, you may have a no-lead BGA or a high temp BGA.
Electronics Forum | Mon Nov 17 07:11:27 EST 2008 | vithalchidrawar
Dear all, I have only hot air gun. Can I do the BGA soldering & BGA ball formation also. Pl suggest vithal
Electronics Forum | Tue Mar 17 11:06:33 EDT 2009 | cyber_wolf
We have never been able to get our IP3 to place BGA's consistently. We installed new bulbs,ran glass plate calibration,played with scan speeds, scan area etc. etc.... I would not recommend this machine for BGA's
Electronics Forum | Wed Nov 04 00:20:26 EST 2009 | martinphill
BGA Rework. Pls suggest whether we can place BGA without Balls on PCB after Printing. i.e without reballing if we mount BGA on PCB after Screen printing
Electronics Forum | Fri Sep 07 16:37:47 EDT 2012 | burb1999
Ive used the Camalot long time ago to dispense paste on BGA pads after removal then reflow with a machine such as the AirVac. What is the best way to do BGA repair on pads? Ive read alot just reball the bga then put it back on? Todd
Electronics Forum | Mon Dec 22 22:05:42 EST 2014 | slouis2014
What could be the possible solution for shorted BGA but only appears on the component corners. The BGA is 18mm x 18mm in size.The component solder balls are within specs and the pad design for the BGA is with standard. How can I solve this problem
Electronics Forum | Wed Apr 03 14:16:16 EDT 2019 | davef
My take ... * Just about every BGA in the world is soldered in a reflow oven * A small portion of the BGA are soldered with rework / repair stations * A very small number of BGA are soldered with hot plates, toaster ovens, selective soldering mach
