Industry News: bga and re-work (Page 5 of 23)

Aven's MicroVue 360 Viewer Attachment Offers Enhanced Precision and Comfort

Industry News | 2023-04-24 19:19:42.0

Aven is proud to announce the release of its latest innovation, the MicroVue 360 Viewer Attachment.

Aven, Inc

Metcal, Nikon and Nordson ASYMTEK to Co-Host BGA Rework and Repair and X-Ray Inspection Seminar at ACI Technologies in Philadelphia

Industry News | 2013-05-01 20:51:31.0

Metcal today announced an additional date for its 2013 Spring series of BGA rework and repair seminars, this time co-hosting with Nikon and Nordson ASYMTEK.

OK International

STI Electronics' BGA Reballer Kit Saves Money and Components

Industry News | 2010-09-26 16:12:24.0

STI Electronics, Inc., a full service organization providing training, electronic and industrial distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, announces that its BGA Reballer Kit allows components to be reused.

STI Electronics

Reworkable Edgebond Adhesive Improves CBGA and BGA Thermal Cycle Performance and Eliminates Underfill

Industry News | 2011-04-07 20:23:54.0

Zymet Inc. has introduced a reworkable edgebond adhesive, UA-2605, that improves thermal cycle performance of CBGAs and plastic BGAs. In one trial, UA-2605 tripled the 0°C to +100°C performance of a CBGA, to nearly 2500 cycles. Previously, an underfill was needed to achieve this level of performance.

Zymet, Inc

KIC and Air-Vac to Hold Free BGA Manufacturing and Repair Seminar

Industry News | 2009-10-13 12:56:51.0

San Diego — October 2009 — KIC, the leader of thermal process development and control products, and winner of multiple industry awards, in conjunction with Air-Vac Engineering Company will hold a free BGA Manufacturing and Repair Seminar at 6 p.m. on Friday, October 23, 2009 at the Hotel Radisson Case Grande, Ciudad Juarez in Juarez, Mexico.

KIC Thermal

ECD Soldering Seminar Will Help Improve Yields, Reduce Re-work and Increase Profitability!

Industry News | 2001-08-02 16:39:57.0

Mr. Ray Chartrand, one of the leading experts in the Soldering Industry, in concert with ECD will be holding a series of cost-saving Profiling Seminar during August 2001. Ray has over 20 years experience troubleshooting soldering, reflow, and cleaning problems for the electronics industry and presently consults for over 40 of the largest industries in the electronic assembly marketplace.

Electronic Controls Design Inc. (ECD)

SHENMAO Debuts Visible No-Clean BGA Flux SMBF-08 for Enhanced SMT Assembly and BGA Ball Mount Process

Industry News | 2023-05-22 18:45:34.0

SHENMAO America, Inc. is proud to announce the release of its new SMBF-08 Visible No-Clean BGA Flux. This innovative flux is specifically designed to meet the demands of surface mount technology (SMT) assembly and BGA ball mount processes, offering enhanced visibility and performance.

Shenmao Technology Inc.

Working with QFNs and QFPs

Industry News | 2018-10-18 09:05:06.0

Working with QFNs and QFPs

Flason Electronic Co.,limited

Blind and Buried Via Boards

Industry News | 2018-10-18 11:14:24.0

Blind and Buried Via Boards

Flason Electronic Co.,limited

Lead-Free (Pb-Free) Solder and Composition

Industry News | 2018-12-08 03:38:44.0

Lead-Free (Pb-Free) Solder and Composition

Flason Electronic Co.,limited


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