Parts & Supplies | Pick and Place/Feeders
Transfer-X Motor Die Attach
Parts & Supplies | AOI / Automated Optical Inspection
Panasonic AI PARTS AV131 N210028285AA BENDING DIE
_1.jpg)
Parts & Supplies | AOI / Automated Optical Inspection
AV131 N210028286AA BENDING DIE We are professional SMT part supplier,if you are interested in our products ,pls contact me.Thank you! M/P: +86 15323874439/18818686907 becky(at)hysmt(dot)cn beckysusmt(at)hotmail(dot)com Skype: beckysmt www(dot
Parts & Supplies | SMT Equipment
AI PART N210028285AA BENDING DIE for AV131 5 AVB LEVER 1304005 6 AVB PISTON 1304008 7 AVB LEVER 1304011 8 AVB INSERTION GUIDE (10mm) 1304014 9 AVB PUSHER (10mm) 1304016 10 AVB LINER 1304017 11 AVB
_1.jpg)
Parts & Supplies | Chipshooters / Chip Mounters
104541800701 PUSHER Other AI parts on sale: 10454180000 Insertion Guide 10454180000 Insertion Guide-uncomp 10454180001 Insertion Guide 10454180001 Insertion Guide-uncomp 1045418004 Lever 1045418004 Lever A- Uncomp 1045418005 Lever 1
_1.jpg)
Parts & Supplies | Chipshooters / Chip Mounters
10454180001 INSERTION GUIDE (L) Other AI parts on sale: 10454180000 Insertion Guide 10454180000 Insertion Guide-uncomp 10454180001 Insertion Guide 10454180001 Insertion Guide-uncomp 1045418004 Lever 1045418004 Lever A- Uncomp 10454180
Parts & Supplies | SMT Equipment
0133101 Pin AVF 0233056 Pulley AVF 101637901401 Slider AVF 101133200403 Rack AVF 101795101502 Transfer Chuck Spring AVF 1020308008 Pin AVF 1020308011 Pin AVF 102031200108 Slide Cam AVF 102031200508 Slide Cam AVF 1020312018 Cutter AVF 102031
Orion has high-speed die cutting presses ranging from 1 to 60 tons. We also have stamping presses that range from 1 to 60 tons. Our other Die cutting capabilities include: Production parts up to 60" x 30" Kiss cut parts up to 24" x 30"
Milling Turning Grinding Honing EDM Wire cutting Heat Treatment Machining and assembly of precision dies
Technical Library | 2019-05-21 17:20:36.0
Die attach material selection and process implementation play crucial roles in any microelectronic assembly. The chosen attach methods ultimately affect die stress, functionality, thermal management, and reliability of the assembly. Die attach applications are designed to optimize mechanical attachment of the die to the substrate, to create a thermal path from the die to the substrate, and to create an electrical path for a ground plane connection. Some of the more commonly used die attach materials in the microelectronics industry today are epoxies,polyimides, thermoplastics, silicones, solders, and special low outgassing, low stress, anisotropic adhesives.
