Electronics Forum | Mon Mar 03 14:48:11 EST 2003 | genny
I've never heard of a customer saying just 'we want decoupling caps'. Very interesting. In RF applications - frequencies 50MHz up into several GHz, the location of where they are put is just as important as what the value is. Decoupling caps are p
Electronics Forum | Mon Jul 16 21:29:03 EDT 2001 | davef
Cleaning RMA with water is bad news. It will turn your solder connections white and remove none of the RMA residues. There was a thread on removing RMA within the past two weeks on SMTnet. Check the fine SMTnet Archives. Additionally, look at M
Electronics Forum | Wed Dec 08 14:44:13 EST 1999 | John Thorup
Hi Chuck We make precision analog and hybrib audio processing equipment for the radio and TV broadcast industry. We have not experienced any problems relating to no-clean reflow since the introduction of the process several years ago. It is known t
Electronics Forum | Thu Jul 09 22:45:42 EDT 2015 | cathy247
Hello Maxim, we offer below services with Popular Competitive Pricing: －Express PCB Prototyping(2-28 layer) －HDI PCB －Flexible Printed Board(1-8 layer) －Flexi-rigid Printed Board －High Frequency Board(Rogers,Arlon,PTFE) －Blind/Buried Via Board －High
Electronics Forum | Mon Mar 20 19:27:14 EST 2000 | Marc Ruggiero
Hello, I am looking for inputs (experiential or opinions) concerning field reliability of high-frequency RF boards that have had a trace or pad repair (or both), any package type. If anyone can comment on this subject, I would appreciate it. We bu
Electronics Forum | Thu Mar 29 12:25:19 EST 2001 | slthomas
All arguments about using OA pastes on high frequency boards to eliminate alledged RF interference aside, is it acceptable to touch up SMT components on these boards with a no clean flux cored wire after wave solder? All of our wave machines are usi
Electronics Forum | Sat Jun 19 11:44:00 EDT 1999 | Vic Lau
Do anyone have any experience on assembling high frequency product, 1.8GHz or 2.4GHz. In our production line, we manufacture 1.8GHz product with using no clean paste (RMA type) for reflow and no clean wire for rework. In our functinal test,either at
Electronics Forum | Thu May 09 17:21:39 EDT 2002 | davef
In describing a bare board, you need to talk about base, laminate, and conductive materials. Common laminate materials are: * Glass fabric * Cotton fabric * Paper Common NEMA grades of technical laminates are: * Glass Fabric Grades: G3, G7, G10,
Electronics Forum | Sun Mar 30 21:17:17 EST 2003 | MA/NY DDave
Hi I don't know your PCB, circuit, or product application, and probably should steer you to at least the ESD Association http://www.esda.org/ for one place in case you find anything that you really love. I do know some of these people first hand and
Electronics Forum | Thu Oct 05 10:37:10 EDT 2006 | David
Hello all, We have problem with voids in one of our product. We are soldering IC (package SO8) with under the components grounding connection. The ground pad for this component has 3 via holes (before producing we have to cover this 3 holes from b
