192 imc in pth results

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Effect of Cu–Sn intermetallic Compound Reactions on the Kirkendall Void Growth Characteristics in Cu/Sn/Cu Microbumps

Technical Library | 2014-07-02 16:46:09.0

Growth behaviors of intermetallic compounds (IMCs) and Kirkendall voids in Cu/Sn/Cu microbump were systematically investigated by an in-situ scanning electron microscope observation. Cu–Sn IMC total thickness increased linearly with the square root of the annealing time for 600 h at 150°C, which could be separated as first and second IMC growth steps. Our results showed that the growth behavior of the first void matched the growth behavior of second Cu6Sn5, and that the growth behavior of the second void matched that of the second Cu3Sn. It could be confirmed that double-layer Kirkendall voids growth kinetics were closely related to the Cu–Sn IMC growth mechanism in the Cu/Sn/Cu microbump, which could seriously deteriorate the mechanical and electrical reliabilities of the fine-pitch microbump systems

Nepes Corporation

Pemtron Adds Direct Field Support in Canada

Industry News | 2023-01-16 07:24:10.0

Pemtron Technology is pleased to announce that the company has added direct support in Canada. In addition to its local manufacturers' representative, BROCK Electronics, the company has hired a specialized printed circuit board assembly (PCBA) technician with extensive hands-on experience based in Toronto, Canada.

Pemtron

Investigation of Pad Cratering in Large Flip-Chip BGA using Acoustic Emission

Technical Library | 2013-01-03 20:27:54.0

Electronics assemblies with large flip-chip BGA packages can be prone to either pad cratering or brittle intermetallic (IMC) failures under excessive PCB bending. Pad cratering cracks are not detected by electrical testing or non-destructive inspection methods, yet they pose a long term reliability risk since the cracks may propagate under subsequent loads to cause electrical failure. Since the initiation of pad cratering does not result in an instantaneous electrical signature, detecting the onset of this failure has been challenging. An acoustic emission methodology was recently developed by the authors to detect the onset of pad cratering. The instantaneous release of elastic energy associated with the initiation of an internal crack, i.e., Acoustic Emission (AE), can be monitored to accurately determine the onset of both pad cratering and brittle intermetallic (IMC) failures.

Cisco Systems, Inc.

Influence of Pd Thickness on Micro Void Formation of Solder Joints in ENEPIG Surface Finish

Technical Library | 2012-12-13 21:20:05.0

First published in the 2012 IPC APEX EXPO technical conference proceedings. We investigated the micro-void formation of solder joints after reliability tests such as preconditioning (precon) and thermal cycle (TC) by varying the thickness of Palladium (Pd) in Electroless Nickel / Electroless Palladium / Immersion Gold (ENEPIG) surface finish. We used lead-free solder of Sn-1.2Ag-0.5Cu-Ni (LF35). We found multiple micro-voids of less than 10 µm line up within or above the intermetallic compound (IMC) layer. The number of micro-voids increased with the palladium (Pd) layer thickness. Our results revealed that the micro-void formation should be related to (Pd, Ni)Sn4 phase resulted from thick Pd layer. We propose that micro-voids may form due to either entrapping of volatile gas by (Pd, Ni)Sn4 or creeping of (Pd, Ni)Sn4.

Samsung Electro-Mechanics