Electronics Forum | Wed Jan 31 17:37:23 EST 2007 | GS
Hi, as for IPC-7095, in case of BGA, other important value to inspect/measure (3D) is the volume of paste deposit, mainly when mounting Ceramic BGAs. Regards...GS
Electronics Forum | Mon Jul 12 16:33:10 EDT 2010 | davef
Ideas to follow are: * Review IPC-7095 BGA Process Implementation * Look here: http://www.smtinfo.net/Db/_Ball%20Grid%20Arrays.html
Electronics Forum | Sun Aug 10 21:57:25 EDT 2014 | cmchoue
Does IPC definition for "QFN Void Ration" ? Like IPC 7095 susgestion the BGA Void ratio.
Electronics Forum | Mon Feb 16 13:03:13 EST 2015 | dyoungquist
A good resource for implementing a BGA assembly process is: IPC-7095C Design and Assembly Process Implementation for BGAs Lots of valuable information in that publication.
Electronics Forum | Fri Mar 27 10:16:33 EDT 2015 | dyoungquist
A good resource for implementing/evaluating a BGA process is IPC-7095C - "Design and Assembly Process Implementation for BGAs". I get no monetary or other compensation for promoting that standard but it is fun to mention that a board assembled by my
Electronics Forum | Fri Dec 08 10:21:59 EST 2000 | Jim M
I just received the IPC Fall/Winter catalog from IPC for year 2000.IPC-7095 is listed as released in August 2000. There is a member price as well as non-member price.These spec's are available at www.ipc.org or call them at 847-790-5362. Have fun J
Electronics Forum | Tue May 22 00:01:43 EDT 2001 | philipreyes
Hi to all!! For those who have current process of Placing BGA package (SMT using BGA package), do you have any idea what is the acceptable misalignment of the balls on the pads of PCB? I have here with me the IPC 7095 BGA Assembly and Design but
Electronics Forum | Mon Sep 22 10:52:14 EDT 2003 | Carol
Is there a standard that tells you how many times you can replace a PBGA without reliability issues? I've read IPC-7095 (many times) and have not found a recommendation for this. We have Class 3 products.My thoughts are 2 times max. We place PBGAs
Electronics Forum | Thu Feb 12 21:06:20 EST 2004 | davef
"LGA" [land grid array] is a pretty broad topic. Search the fine SMTnet Archives for background on: * BGA * uBGA * Flip chip * etc Consider: * Area Array Packaging Handbook: Manufacturing and Assembly; Ken Gilleo; McGraw-Hill Professional; 1st edit
Electronics Forum | Wed May 19 04:27:18 EDT 2004 | johnwnz
Also look at IPC 7095 which is all abotu BGA processes including rework. the profile will be 100% based on your board - how many layers, how many are ground & signal, how many of those are the BGA connected to directly or indirectly, the component we
