SMTnet Express, May 5, 2022, Subscribers: 25,613, Companies: 11,567, Users: 27,202 Electronics Manufacturing Technical Articles Rapid Deployment of Automated Test-System for High-Volume Automotive USB-C Hub Adoption and integration
Defect Coverage for Non-Intrusive Board Tests Defect Coverage for Non-Intrusive Board Tests Non-intrusive board test (NBT) is an emerging test methodology that integrates several complementary embedded-instrumentation-based test technologies
Application Of Build-in Self Test In Functional Test Of DSL SMTnet Express May 23, 2012, Subscribers: 25234, Members: Companies: 8880, Users: 33129 Application Of Build-in Self Test In Functional Test Of DSL First published in the 2012 IPC APEX
SMTnet Express, June 16, 2022, Subscribers: 25,423, Companies: 11,577, Users: 27,294 █ Electronics Manufacturing Technical Articles Introduction to Automated Test Fixtures Testing of electronic assemblies involves three elements
SMTnet Express, June 21, 2018, Subscribers: 31,123, Companies: 10,968, Users: 24,855 Design for Testability (DFT) to Overcome Functional Board Test Complexities in Manufacturing Test Louis Y. Ungar; A.T.E. Solutions, Inc. Manufacturers test
SMTnet Express, May 20, 2021, Subscribers: 27,111, Companies: 11,359, Users: 26,657 Rapid Deployment of Automated Test-System for High-Volume Automotive USB-C Hub Adoption and integration of USB-C chargers and hubs in automotive
SMTnet Express, December 17, 2015, Subscribers: 23,898, Members: Companies: 14,823, Users: 39,585 Good Product Quality Comes From Good Design for Test Strategies Adrian Cheong; Agilent Technologies, Inc. Product quality can be improved through
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Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages This paper presents the drop test reliability results for edge-bonded 0.5mm pitch lead-free chip scale
