Electronics Forum | Wed May 01 10:16:05 EDT 2002 | davef
Consider contacting Alpha Metals at http://www.alphametals.com/tech_services/index.html
Electronics Forum | Thu Oct 03 10:02:08 EDT 2002 | davef
Your problem is likely not the Pd-Ag surface layers, but the underlying metal to which you need to wet. Either a base metal is: * Contaminated and poorly wettable. OR * A material [eg, Alloy 42 (check with magnet), Kovar, etc] that is inherently dif
Electronics Forum | Fri Feb 28 12:08:07 EST 2003 | davef
Paul We don't like to mix metals on press fits. Yano, we do gold on gold or solder on solder, but we don't mix metals [except with imm silver / tin] to avoid electrochemical corrosion. Is that bad information or does AMP think that's not a problem
Electronics Forum | Thu Sep 25 18:31:24 EDT 2003 | davef
Denis: You could be correct about metal reflecting IR. When we use our old IR station, we place pieces of aluminum foil around the component to be removed to protect the near-by components.
Electronics Forum | Mon Dec 22 12:41:17 EST 2003 | Marc Simmel
No clean solder paste. One further observation ... the parts have a metal shell and are 'floating' high on the paste. Though there is wetting on the metal shell, it doesn't seem to sink as far as it should and this could be lifting the soldertails f
Electronics Forum | Fri Aug 06 03:24:53 EDT 2004 | Andrew
Can someone explain why there is yellowish spot at the area the metal is stressed(drilled,bend area)?How the supplier resolve this problem?
Electronics Forum | Thu Oct 21 08:25:23 EDT 2004 | fcox
What are the most common solvents/processes being used to clean paste from metal stencils? Any heat?
Electronics Forum | Mon Nov 15 19:08:47 EST 2004 | grayman
For fine pitch components we would suggest slow movement of metal squeegee. The effect of angle is minimal. You may check squeegees from Transition Automation they can help you with the holder and the best squeegee. I do not have the web site, Arman
Electronics Forum | Thu Dec 09 17:45:27 EST 2004 | davef
You're correct. There is no criteria for no-lead, but there none for SnPb, either. Solder joint strength in pull/shear will vary with lead geometry, solder volume, lead metal/metallization, the way the test is done.
Electronics Forum | Thu Feb 17 08:14:57 EST 2005 | davef
The issue may not be the solderability protection. It could be that the metalization on the component terminal or the metal of the component terminal was not prepared properly before the solderability protection was added.
