Electronics Forum | Tue Dec 27 10:18:03 EST 2016 | anhsang38
Dear Pro, I want to confirm with you about conveyor speed. is 1m/s? We are using wave soldering but it is 1.2m/min, min not second. Pls, check it agian. The flux is not relative this error. It is relative no sodering, bridge. The solder bar is the
Electronics Forum | Wed Dec 11 12:07:33 EST 2019 | scotceltic
Our company has a spec on their current PCB dwg to make sure the fab house meets a specific thickness (min-max). The current spec reads: 13.5um min - 38.5um max. I assume it is to keep the board house honest and to make sure there is no exposed co
Electronics Forum | Tue May 23 21:14:22 EDT 2006 | davef
First, where the temperatures that aare mentioned in the original post measured? Second, it sounds like the PdAg component terminations are not seeing enough heat [your soldering iron touch-up proves this]. Your 232*C peak is the absolute minimum s
Electronics Forum | Wed Mar 08 10:52:27 EST 2000 | Wolfgang Busko
Hi Jacqueline, for the "manufacturing allowance" IPC says FAB.TOL. is the board manufacturing tolerance and PLACE ACRCY is the pick and place accuracy. For 0,8 mm pitch they give for both values 0,1 mm. Solder joint design goal data comes from empir
Electronics Forum | Wed Mar 08 10:52:27 EST 2000 | Wolfgang Busko
Hi Jacqueline, for the "manufacturing allowance" IPC says FAB.TOL. is the board manufacturing tolerance and PLACE ACRCY is the pick and place accuracy. For 0,8 mm pitch they give for both values 0,1 mm. Solder joint design goal data comes from empir
Electronics Forum | Fri May 01 18:01:04 EDT 1998 | Peter Soland
Has anyone experienced profile related microbridging under 0402 capacitors in the past. We use a Sn46Pb46Bi8 paste, 178 degree C L.T.. Double sided board, 2 per panel, 6.5" x 5", convection oven. Profile data; thermalcouples @ components showing 200
Electronics Forum | Fri May 01 22:32:38 EDT 1998 | Jon Medernach
A pad design shaped like Home Plate will eliminate the problem, You can get info from Create Group at Panasonic FA They have the patent on this style pad and the most experience working with the 0402 and now have qualified the 0201 Caps from Murata
Electronics Forum | Mon Jan 07 20:37:15 EST 2002 | davef
For soldered areas, we like to keep gold thickness substantially below the maximum you propose. Search the fine SMTnet Archives for our discussions on the topic of acceptable levels of gold with solder connections. Let�s fix this �no one seems be s
Electronics Forum | Tue Jun 04 17:10:13 EDT 2002 | davef
First, �flash gold� is very loose language. It means different things to different people. �Flash� gold is a thin coat of immersion gold. Imm gold self-limits at ~0.3um[12uin]. And fabs put-down �flash� prior to electroplating thicker gold for wi
Electronics Forum | Mon Aug 22 09:01:09 EDT 2005 | iwan
Well guys, I just buy a brand new solder paste softener Malcom type SPS2, I've tried with this with this viscosity result. I Use Almit Solder Paste Lead Free LFM-52X 1 min : 264 pas. 2 min : 272 pas. 3 min : 277 pas. I use standard for Viscosity 20
