JUKI RX-8 Pick and Place Machine JUKI RX-8 Pick and Place Machine Max PCB: 510mm×450mm Placing Speed:100,000CPH Weight: Around 1,810kg Dimension:998mm×1,895mm×1,530mm Product description: JUKI RX-8 Pick and Place Machine, Max PCB: 510mm×45
JUKI RS-1 Pick and Place Machine Applicable Components: 0402~5050 Board size:50×50-650×370mm Feeder inputs:max.112 placement capacity:42,000 CPH Product description: JUKI RS-1 Pick and Place Machine, High speed 42000CPH 8 Nozzle,
Yamaha sigma-G5S II Pick and Place Machine Speed: 90,000 CPH Applicable PCB: L610×W510 mm Weight: 1,800KG Dimension: L1,280×W2,240×H1,450 mm Product description: Yamaha sigma-G5S II Pick and Place Machine, Speed: 90,000 CPH, Applicable PCB: L6
Yamaha YRM20 Pick and Place Machine Speed:115,000CPH rotary head PCB Size : L810 x W510mm Feeder input:Max. 128 types = 32 feeders x 4 Weight: 2,250kg Product description: Yamaha YRM20 Pick and Place Machine, Speed:115,000CPH rotary head, PCB
JUKI RS-1 Pick and Place Machine Applicable Components: 0402~5050 Board size:50×50mm-650×370MM Feeder inputs:max.112 placement capacity:42,000 CPH Product description: JUKI RS-1 Pick and Place Machine,Applicable Components: 0402~50
JUKI RS-1 Pick and Place Machine Applicable Components: 0402~5050 Board size:50×50-650×370mm Feeder inputs:max.112 placement capacity:42,000 CPH Product description: JUKI RS-1 Pick and Place Machine High speed 42000CPH 8 Nozzle, Applicable Com
Hanwha Pick and place machine DECAN S2, Samsung Pick and place machine DECAN S2, Hanwha chip mounter DECAN S2, Hanwha (Samsung chip mounter) chip mounter DECAN S2 has better area capacity than competitors' similar equipment, * optimized High-speed pl
Yamaha YSM10 Pick and Place Machine Speed: 46,000 CPH Applicable Components:03015- W 55mm x L 100mm Weight:1270KG Dimension:L 1,254 x W 1,440 x H 1,445 mm Product description: Yamaha YSM10 Pick and Place Machine, Speed: 46,000 CPH, Applicable
The long-term inspection solution for wave, reflow, pre-reflow and selective soldering. In the manufacturing of electronic assemblies, optimization of the production processes is a major factor in the success of producing to the high demands of qual
New Equipment | Soldering Robots
With the C-Quence™ Nordson DIMA offers innovative automated and integrated in-line solutions for Hot Bar Reflow Soldering, Heat Seal Bonding, ACF Laminating and/or Heat Staking applications. With Nordson DIMA's automated and integrated C-Quence™
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
1750 Mitchell Ave.
Oroville, CA USA
Phone: (888) 406-2830
