Industry News | 2024-03-11 14:58:44.0
New this year, student scholarship awarded by IPC Education Foundation
Industry News | 2020-01-23 17:30:46.0
ASYMTEK brings its latest fluid dispensing and conformal coating solutions to IPC APEX EXPO, San Diego, CA, in booth 1611. New at IPC APEX is the ASYMTEK Vortik™ family of progressive cavity pumps (PCP), with the smallest depositions possible on the market today. The VPs, VPm, and VPg pumps rely on positive displacement to provide continuous needle dispensing of one- and two-component fluids with high-volumetric accuracy, increased reliability, and reduced cycle time. At 0.2 microliters per second, the Vortik VPs offers the lowest flowrate and smallest depositions possible across all PCP pumps available in the market today - delivering precise control of narrow lines and small shots for two-component mixed fluids.
Industry News | 2020-11-19 20:55:18.0
Temperature cycling test or thermal cycle testing is done on substances to determine the immunity of vulnerability to alternating extremes of low and high temperatures. You can utilize temperature cycling test chambers to test nearly all commercial goods to determine how they withstand extreme temperature changes. The intent of analyzing a product under these conditions is to detect changes in the goods' characteristics and assess the failure incidence of distinct substances and thermal expansion coefficients.
Industry News | 2010-03-17 18:31:55.0
EAST HANOVER, NJ – Zymet has introduced a new silica-filled reworkable board-level underfill encapsulant, X2825, whose coefficient of thermal expansion, CTE, is 26 ppm/°C. The underfill enhances drop and shock test reliability and, compared to higher CTE underfills, provides superior thermal cycle performance.
Industry News | 2013-02-06 12:38:27.0
Murrietta Circuits now provides Environmental Testing services for a wide range of products and applications, including thermal cycling and vibration testing. The thermal cycling services are now performed in-house with the recent acquisition of a thermal cycling test chamber from Russells Technical Products.
Industry News | 2013-11-01 13:11:17.0
Indium Corporation's new SACM™ is a high-reliability solder alloy that offers drop shock performance far superior to other SAC alloys, without compromising on thermal cycling – all at a cost below that of typical SAC solder alloys.
Industry News | 2011-12-30 23:35:59.0
Nihon Superior will issue a new series of guides on “Key Factors in the Selection of Lead-Free Solders.” This series is intended to address the challenges in choosing a reliable lead-free solder. The first guide in the series is titled “Reliability of Lead-Free Solder in Thermal Cycling.”
Industry News | 2022-07-16 08:39:50.0
SHENMAO America, Inc. is pleased to announce that the PF918-S Lead-Free BGA Sphere features the newly designed high-reliability alloy PF918 that can achieve tensile strength performance 1.4 times higher than the typical SAC305 alloy.
Industry News | 2011-04-07 20:23:54.0
Zymet Inc. has introduced a reworkable edgebond adhesive, UA-2605, that improves thermal cycle performance of CBGAs and plastic BGAs. In one trial, UA-2605 tripled the 0°C to +100°C performance of a CBGA, to nearly 2500 cycles. Previously, an underfill was needed to achieve this level of performance.
Industry News | 2009-09-17 17:02:12.0
EAST HANOVER, NJ – Zymet has introduced a new reworkable underfill encapsulant, CN-1728, designed to underfill Package-on-Package (POP) assemblies. Underfilled POP’s have greater difficulty in passing thermal cycle tests than underfilled BGA’s. Compared to earlier generation underfills, CN-1728 has a lower coefficient of thermal expansion and higher Tg, and better compatibility with flux residues, both of which contribute to its superior thermal cycle performance.
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