Industry News | 2001-02-12 16:28:41.0
Ultrasonic Systems introduces the EZ-Flux automatic spray fluxing system for economical application of flux to printed circuit boards. EZ-Flux utilizes spray nozzle technology with two-direction spray. An air-actuated traversing mechanism provides precise motion control at a speed of 10-15 inches per second.
Used SMT Equipment | Soldering - Wave
Vitronics Soltec Delta Wave Solder The Delta Wave Soldering System is designed for three-shift, high volume production with maximum uptime. Precise and repeatable soldering results are provided by digital motor controls which maintain variation to
Industry News | 2024-01-08 12:50:59.0
Kodiak Assembly Solutions LLLP proudly marks its 20th anniversary. Established in 2004, Kodiak Assembly has traversed a remarkable path from its humble beginnings to its current position as an industry leader.
The XM is a manual screen and stencil printer dedicated to small batch size production and prototyping purposes. The sideways guided squeegee traverse and the adjustable squeegee pressure ensure a constant, high quality print. Simple operation and sh
SNE-4500M Plus The Highest-end Tabletop SEM Cost-effective Table-top SEM with Max. 150,000x of magnification by miniaturizing modules. Able to scan images with high resolution of 5nm by the installation of the variable aperture with ease of us
Used SMT Equipment | Adhesive Dispensers
Asymtek Dispensing System Model: A-612C appears to be in pretty nice cosmetic condition having a few dings and scratches from normal useage This Tool does power-up, the interior lights come on as well as lights on the operation panel. The CP
Technical Library | 2020-05-07 03:46:27.0
The selective soldering process has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty, however some types of challenging components require additional attention to ensure optimum quality control is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures and/or pallets often places an additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors,can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues due to their beryllium copper termination pins.
Technical Library | 2022-08-08 15:06:06.0
Selective soldering has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty however some types of challenging components require additional attention to ensure that optimum quality is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures, or solder pallets, often places additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors, can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues because of their beryllium copper base metal pins. Key Terms: Selective soldering, drop-jet fluxing, sustained preheating, flux migration, adjacent clearance, lead-to-hole aspect ratio, lead projection, thermal reliefs, gold embrittlement, solderability testing.
New Equipment | Industrial Automation
Contact: Sandy Lin Email:unity@mvme.cn Skype:onlywnn_1 Mobile(Whatsapp): (+86)-18020776786 QQ :2851195456 XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD Our services Packing & Delivery 1)100% full New! - Original Factory Seal ! 2)Warranty: 12 m
New Equipment | Cleaning Equipment
●Cleaning Substrate, Cassette, Subtray, Magazine and other carriers and trays ●Ultrasonic cleaning with high efficiency, can save time and human resource. ●Using DI WATER instead of solvent, environmental protection and no fire hazard. ●High efficien
