Industry News: via hole tenting (Page 5 of 14)

Process Fills Vias Faster than Squeegees

Industry News | 2003-03-11 09:04:04.0

Developed in response to customer requirements, the new Via Fill process from DEK delivers 100% fill of substrate vias with no voids and minimal surface residue.

ASM Assembly Systems (DEK)

Plated Half Holes PCB

Industry News | 2018-10-18 10:46:44.0

Plated Half Holes PCB

Flason Electronic Co.,limited

Ventec Giga Solutions Appointed as Distributor for Sunus Printing Machines

Industry News | 2023-11-13 12:22:31.0

Ventec Giga Solutions, the equipment division of Ventec International Group announces its appointment by Sunus Precision Machinery as sales agent and distributor of Vacuum Filling Holes Solutions and Screen Printing Equipment. The agreement covers all regions globally outside of Asia.

Ventec International Group

Multitest’s Chris Cuda to Discuss Pros and Cons of ATE Boards at BiTS 2011

Industry News | 2011-02-07 15:33:41.0

Multitest announces that Chris Cuda, US Product Manager, will present a paper titled "Benefits & Risks of High Aspect Ratio Vias in ATE Boards" at the upcoming Burn-in & Test Socket Workshop, scheduled to take place March 6-9, 2011 at the Hilton Phoenix East/Mesa Hotel in Mesa, Arizona.

Multitest Elektronische Systeme GmbH

MacDermid Alpha to Exhibitat TPCA and Present atIMPACT-EMAP 2020 Conference

Industry News | 2020-10-04 15:41:30.0

MacDermid Alpha Electronics Solutions will be exhibiting at the Taiwan Printed Circuit Association (TPCA) exhibition and presenting two technical papers at the IMPACT-EMAP Conference, co-located with TPCA in Taipei, October 21-23, 2020. The papers detail some of the ways in which MacDermid Alpha has invested in the research of innovative manufacturing processes to meet the demanding standards required for the new age of miniaturization.

MacDermid Alpha Electronics Solutions

New Evaluation Software For The Multilayer PCB Inspection

Industry News | 2001-06-05 06:05:27.0

The X-ray inspection of multilayer PCBs increasingly requires an objective evaluation of e.g. inner layer misregistrations and annular ring widths at through-hole platings. After the recent release of the new software ml|module by phoenix|x-ray the necessary measurements of test patterns and vias can be performed easily and exactly. As all the application orientated software modules by phoenix|x-ray the ml|module can be integrated into auto-positioning (CNC) inspection programmes.

phoenix|x-ray Systems

Don't Miss KYZEN’s QFN Design Considerations to Improve Cleaning during SMTAI

Industry News | 2014-09-19 20:19:38.0

KYZEN is pleased to announce that Dr. Mike Bixenman will present the paper titled “QFN Design Considerations to Improve Cleaning – A Follow on Study” at the upcoming SMTA International exhibition.

KYZEN Corporation

Test Interface Boards – Customers Appreciate Multitest Pulse Plating Process for Board Fab

Industry News | 2012-08-20 13:00:35.0

Multitest, announces that its Pulse Plating Process provides significant advantages in terms of fabrication cost and cycle time.

Multitest Elektronische Systeme GmbH

Test Interface Boards – Customers Appreciate Multitest Pulse Plating Process for Board Fab

Industry News | 2012-08-20 13:01:17.0

Multitest, announces that its Pulse Plating Process provides significant advantages in terms of fabrication cost and cycle time.

Multitest Elektronische Systeme GmbH


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