Electronics Forum | Tue Dec 21 16:47:15 EST 1999 | GERARDIN
Hello Pascal As mentioned by Wolfgang the key issue is the printing process capability. For a thick copper level 90�m we noticed that the pad reduction can be greater than 20% depending on supplier sources. Typicaly for a cad Width = 0.4 we can
Electronics Forum | Sat Dec 21 12:43:50 EST 2002 | V.RAMANAND KINI
In my opinion its based on the final price advantage you get. And also just because it is cheap to manufacture do not jump to start. See how long your product will sell and what is the product life cycle. There are many mfrs who can offer you reliab
Electronics Forum | Fri Dec 17 06:11:33 EST 1999 | Christopher Lampron
Henry, TNT makes some good points. I have also found that the use of a 2% silver solder paste (provided that it's allowable) can help reduce the occurance. You may want to run a thermal profile on the PCB is question. Is the board thermaly equalized
Electronics Forum | Fri Dec 17 08:45:26 EST 1999 | Wolfgang Busko
Hi Henry, amoung all things that cause this funny effect the most effective measures in my experience were good PCB design (pads and equal thermal conditions for both sides of the components), placement accuracy and profiling, profiling, profiling. L
Electronics Forum | Tue Dec 14 10:36:42 EST 1999 | Paul Peterson
I recently encountered reflow soldering defects on a pair diode package, the smd pad had a green contamination, I'm convinced that this is not oxidation. The no-solder condition appears to be caused by a sloppy soldermask process, although over the y
Electronics Forum | Mon Dec 13 21:05:34 EST 1999 | Curtis T.
Ken, we always build the bottom side of the board first. That also insures that there isn't any problems with the actives being reflowed and falling off in the glues curing process. By the way we do both paste and glue on the bottom of the boards t
Electronics Forum | Mon Dec 06 14:56:49 EST 1999 | Russ
The best way that I have found to calculate CPk for placement machines is to buy the kit that is usually provided by the manufacturer of machine. It usually consists of a glass plate and glass components that are scaled. You simply program the mach
Electronics Forum | Tue Nov 30 12:02:02 EST 1999 | Steve
Hello All, We assemble boards which are small in size. We use nests for support when screen printing the boards. The nest gives support along the edges of the board. However we are bringing in a new product which has components very close to one edg
Electronics Forum | Thu Nov 18 08:43:30 EST 1999 | Will Buehler
We currently stuff parts on one side and use a reflow oven. We have been told that many companies are stuffing both sides without high-temp solder or glue. I understand that glue is usually only needed for wave soldering processes. Is it true that
Electronics Forum | Wed Nov 17 11:36:16 EST 1999 | JAX
If this is going to be the beginning of a lucrative and fast growing company you probably want to go with Fuji ( CP series ) , it's by far the fastest and longest lasting. If money is a big issue at this time and you want to get the biggest bang for
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