Electronics Forum | Thu Apr 26 21:09:14 EDT 2001 | davef
Hey Wolfgang: I was down at Jimbo's and tried a McEwan's Pale Ale, yech!!! And Scotch beer [eg, McEwan's Scotch Ale, Tennant's] has been so berry, berry good to me, helping to sauve the travails of winter, until I could starting working on wheat be
Electronics Forum | Thu Oct 26 17:42:29 EDT 2000 | Philip A. Reyes
Hi Mr Paul! Thanks for answering my previous questions. Hope you can still accommodate my other queries. This is about the acceptable criteria of PBGA defects after reflow soldering. 1.What is the allowable (min and max. ball misregistration / misal
Electronics Forum | Thu Jul 20 15:37:53 EDT 2000 | Tekguy2000
These parts are flat chip resistor arrays that have 4 end terminations on each side. It looks liek an IC but is typically in an 0805 and 1206 package type with convex terminations. .031" pitch from termination to termination and .011" spacing between
Electronics Forum | Wed May 09 11:25:29 EDT 2001 | medernach
What type of preheaters do you have on you're wave? I have to agree with Dave. Your leads are not cold, they are hotter than the annular ring on the PCB. This would cause the solder to go to the lead only rather than the component and land pad / a
Electronics Forum | Tue May 22 17:21:43 EDT 2001 | davef
BGA require placement accuracy of only 0.3mm (�12 thou), compared with a required placement accuracy of 0.08mm (�3 thou) for fine pitch devices. Even with this level of misalignment, plastic BGA self-center / self-correct during reflow due to symmetr
Electronics Forum | Tue Apr 22 14:53:22 EDT 2003 | Robert
OK...I'm hooked on this subject. Were changing from NiAu to OSP as a "savings" and not because we choose too. So far we have had great success with BGA and are working on TSOP, SOP, etc. The only thing we have come to dislike so far is the ring aroun
Electronics Forum | Sun Jun 10 11:31:27 EDT 2001 | nifhail
Everybody aware of the tomb-stone problem on 0402 package. I've done everything I could i.e. Profile, placement, 10 Deg placement, stencil design, but still this culprit exist. One things for sure is taht I have a very bad pad size for 0402 ( 25 mil
Electronics Forum | Wed Jun 13 21:25:48 EDT 2001 | dougk
We've tried the MPM rheo., with excellent results. We saw a decrease in fine-pitch pad coverage rejects from ~20% to bacicially ~0%. Print speeds went from 1-2 in/sec (metal blade) to 4-5 in/sec (rheo.). Could probably go faster. Great throughput. Li
Electronics Forum | Mon Jun 18 21:31:16 EDT 2001 | davef
I know of no nor can I imagine a specification for "spring pressures or the requirement for pin marks on the test pads". The issue is whether the boards pass the test or not. If your supplier neglected to process the boards as agreed upon, then the
Electronics Forum | Mon Jun 18 10:14:30 EDT 2001 | surachai
HI ALL; I WOULD LIKE TO KNOW THAT ANYBODY CAN RUN GLUE PRINTING PROCESS WITH 0402 CHIP AND PASS THEM TO WAVE SOLDERING PROCESS ,PLEASE GIVE ME THE INFORMATION ABOUT THEM . 1)HOW WIDE OF APERTURE DO YOU OPEN ON YOUR STENCIL? 2)HOW MANY YIELD OF THIS P
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