Electronics Forum: qfp (Page 45 of 119)

Using solder paste in rework

Electronics Forum | Sun Apr 25 10:28:46 EDT 1999 | Joe Cameron

Hello all, Been doing some comparisons on joints made using the soldering iron versus reflowed solder paste (on a QFP package). The difference is quite significant: the joints made by the soldering iron are inconsistent and in many cases not filled

Re: Lifted Leads on Fine pitch QFP's

Electronics Forum | Mon Apr 19 08:50:46 EDT 1999 | J.H.

25 PPM)! | | 1. Is there a better process to solder the leads of QFP's with lifted "minute" lifted leads still having a realiable solder joints? | | 2. Or has anybody tried modifying solder pads and use thicker solder paste deposit to compensate fo

Re: Lifted Leads on Fine pitch QFP's

Electronics Forum | Mon Apr 19 14:38:01 EDT 1999 | Chrys Shea

25 PPM)! | | 1. Is there a better process to solder the leads of QFP's with lifted "minute" lifted leads still having a realiable solder joints? | | 2. Or has anybody tried modifying solder pads and use thicker solder paste deposit to compensate fo

Re: Lifted Leads on Fine pitch QFP's

Electronics Forum | Mon Apr 19 22:52:59 EDT 1999 | Dean

25 PPM)! | | 1. Is there a better process to solder the leads of QFP's with lifted "minute" lifted leads still having a realiable solder joints? | | 2. Or has anybody tried modifying solder pads and use thicker solder paste deposit to compensate fo

Re: Lifted Leads on Fine pitch QFP's

Electronics Forum | Tue Apr 20 23:18:48 EDT 1999 | KEVIN SIMPSON

25 PPM)! | | 1. Is there a better process to solder the leads of QFP's with lifted "minute" lifted leads still having a realiable solder joints? | | 2. Or has anybody tried modifying solder pads and use thicker solder paste deposit to compensate fo

Absolutely, no glue, no fuss.

Electronics Forum | Tue Apr 06 09:50:58 EDT 1999 | Justin Medernach

| Does anybody put QFP's on the backsides of boards? Can they be reflowed without falling off? Do you use adhesive? | I use a double sided reflow process all day, everyday. I've hung QFP240s with embedded heat sinks and they don't fall off. Yei

Re: Wave Soldering Active Components

Electronics Forum | Wed Mar 24 19:26:25 EST 1999 | Marc Ruggiero

| Hi Folks, | This is my first surface mount board, so I asked our assembly house for some tips. They said only passives on the bottom side-preferably no smaller than 0805, 0603 only if I have to. I would think that an SOT-23 would be OK on the botto

Component Packaging Trends

Electronics Forum | Thu Oct 15 14:35:44 EDT 1998 | Joseph Belmonte

Hi Folks, As I travel our industry it seems to me the trend is to move from finner and finner pitch QFP's to array packages (BGA's, CSP's, etc.). Do you folks see the same trend? What is the finest pitch QFP package you have used in your process? Are

Re: Anyone have experience/comments on SAMSUNG SMD placement machines

Electronics Forum | Tue Sep 15 13:30:40 EDT 1998 | Dave F

| We are looking at a third P&P machine for our factory. I have received brochures on a SMASUNG CP30V machine. It looks great and has all the plus points for a contract manufacturing company such as ourselves. The basic specs are: | 14400 cph - 3 he

Re: Placing 160 Pin QFP on Fuji HP machine?

Electronics Forum | Wed Feb 25 23:19:41 EST 1998 | Steve Gregory

Eric, You've got a Fuji FHP? WOW! It still runs even! That was the first fine pitch machine I ever worked with, along with the FEP's and CP-2's. Unless Fuji has changed the machine software, I don't know what he may be talking about. They


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