Electronics Forum | Mon Jul 05 03:53:36 EDT 2004 | johnwnz
Hey, this is something that I've looked at and published a paper on back in 2003 at Apex, actually pert of one, the other part was lookign at how effective X-ray systems (lamanography systems) were at detecting & measuring BGA void size accuratly (co
Electronics Forum | Mon Jul 26 21:56:53 EDT 2004 | pdeuel
The camera is not driven from the motor cards. The camera is attached to what is called a forcer. For the Y axis there are two of them. One is wired backwards from the other. one of the forcers is connected to a flex chanell for the air and electrica
Electronics Forum | Tue Jul 20 12:49:38 EDT 2004 | mmjm_1099
We are having a problem with our Heller 1800W oven with certian parts skewing. It seems that some inductors and taller Can caps are shifting around in the oven. It seems it will solder fine and than all of a sudden just be off to one side or the othe
Electronics Forum | Fri Aug 06 15:32:03 EDT 2004 | Shean Dalton
Thanks for providing the pictures. We evaluated what we could see and have the following idea's. 1) Because of different thermal charatoristics between the topline and your product, your Motorola BGA solder joints may have experienced a higher refl
Electronics Forum | Fri Aug 06 08:38:25 EDT 2004 | Bob R.
You don't mention the board surface finish, but BGA's on NiAu are prone to brittle fracture in the Sn-Ni intermetallic on the board side of the joint. You may not be able to see it visually, but it would show up in a cross-section. In-circuit test
Electronics Forum | Wed Aug 18 00:53:16 EDT 2004 | Grant
Hi, I think you cannot go wrong with Convection. If you want to experiment with VP, just get some of the fluid and put it into a pasta cooker on a standard domestic hot plate. Have a basin full of cold water so after reflow you can lift the cooker a
Electronics Forum | Tue Aug 24 22:32:18 EDT 2004 | pdeuel
We have a Soltec Deltawave with single nozzle spray fluxer, chipwave, and waveform. It preforms well. I am not fimilar with Electrovert models so I can only give you some of the pitch I got when I went back East for training. Features I like about th
Electronics Forum | Tue Aug 24 14:49:58 EDT 2004 | jamyboy
Hi, I am trying to assemble a LTCC component > with Pd/Ag surface finish on to Sn/Pb/Ag solder > and Sn/Ag/Cu solder. I am passing it through a > reflow. I have observed poor wettability at the > solder-pad joint. Does anyone have information
Electronics Forum | Tue Aug 31 13:23:37 EDT 2004 | frankracine
Thanks Ken for your reply. Concerning OSP, there are a few negative points that I must considered for our application. I've read all the following points in an Entek document. Never test it. - If you have a miss print and you clean the PCB, the co
Electronics Forum | Thu Sep 02 14:02:49 EDT 2004 | russ
Frank, We are currently running lead free for approximately 1 yr. now but no where near the volumes you have mentioned. We are about 5k units per month. I personally am in agreement with you as far as OSP. I also do not like white tin finish since
