Electronics Forum | Thu May 10 09:57:22 EDT 2001 | zam_bri
Hi Cal/Dave F, Good news today. The problem went away when I received and ran with a brand new component today. But I'm sure with a robust profile, I should be able to compensate oxidations at some degrees, rite? ( taking into consideration the suc
Electronics Forum | Fri May 11 15:43:41 EDT 2001 | davef
More information would be helpful. For instance: * Talk about the distribution of the problem, including a single lot or from various lots and over components and component types on the board * Tell us about the board (ie, thickness, type, solder ma
Electronics Forum | Tue Feb 01 21:48:12 EST 2000 | Dave F
Guo: You want to know: 1 Can I use water as the solvent in an ultrasonic machine to remove solder paste from PCB? Continuing from Jason�s comments: Sure you can use water as the solvent to remove solder paste from PCB, but recognize that some flu
Electronics Forum | Mon Jan 31 14:08:26 EST 2000 | Ashok Dhawan
I have got a number of assemblies back from a customer with feedback that the solder fillet is less than 25% of chip height per IPC-Standard-610B Class 2. Most of my joints are having good wetting but fillet height does not meet min ht requirement of
Electronics Forum | Tue Dec 07 16:34:54 EST 1999 | Russ
Wolfgang, I appreciate your continued feedback! The main reason that I shortened the Time Above Liquidous (TAL) was it appeared that I was burning off all of the flux from the paste. By shortening the TAL to 45 seconds and decreasing peak temp to
Electronics Forum | Thu Nov 25 21:43:49 EST 1999 | cklau
Via is normally a plated thru holes in (0.63 to 1.0 mm (0.025" to 0.040") diameter lands , which unless properly treated they must be located away from the component lands to prevent the solder migration off the component land during reflow soldering
Electronics Forum | Fri Nov 26 09:13:10 EST 1999 | Wolfgang Busko
Jeff, Ted, Stefano What Stefano is saying sounds reasonable. With entry-level systems its always a struggle to get sufficient results. The operators golden hand is needed. Better controlled advanced dispensing systems should do the work, unluckily I
Electronics Forum | Wed Oct 06 00:26:04 EDT 1999 | Karlin
| Hi, | | Help! Could anyone help to enlighten me on this? | | Question: | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water cl
Electronics Forum | Wed Oct 06 08:41:42 EDT 1999 | Dave F
| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n
Electronics Forum | Sat Sep 11 03:44:40 EDT 1999 | Brian
1 MOHM, 18 MOHM)? | | | | What state are you located? | | | | What type of volume will you use (1 drum per week, month, year)? | | | | Mike | | (800) 218-8128 | | | | We are located in Illinois (Southwest Suburb of Chicago). Our usage will prob
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