Electronics Forum | Sat Dec 16 10:03:32 EST 2000 | Dave F
Castellation. A recessed metalized feature on the edge of a leadless chip carrier [LCC] that is used to interconnect conducting surface or planes within or on the chip carrier. If you search the fine SMTnet Archives, you find: * A fine thread [cast
Electronics Forum | Mon Nov 27 12:13:39 EST 2000 | rabell
Dave, this is a massive question, and if you have any hard data on these issues, it would be wonderful if you could share it. The best I can offer is some indication of our experiences from contacts in the industry. Keep in mind as well, that we ha
Electronics Forum | Thu Jun 22 14:57:34 EDT 2000 | Lee
Mike, when you ask if companies afford to place additional environmental constraints on the manufacturing process, perhaps we should ask whether they can afford not to pay attention to environmental issues. I know this sounds a little flippant, but i
Electronics Forum | Sat Jun 23 08:29:04 EDT 2001 | davef
Well, at least I don�t feel so bad that we�re not the only ones going anal on this blankin� cap thing. We�re gunna change process on ever effin wave soldered SMT cap!!! I�m going to off myself!!!! And in about 15 seconds, some doodoo brain is goin
Electronics Forum | Thu Nov 04 20:44:31 EST 1999 | Keith Luke @ SMTnet
Recent weeks have indeed seen the departure of Earl Moon and Brian from our forum. We recognize that both were valuable contributors to our growing community, and regret their decisions to apparently move on. The staff at SMTnet has worked hard t
Electronics Forum | Sun Oct 10 17:50:00 EDT 1999 | JohnW
| | We've recently encountered this problem where one of our .050" pitch BGA's were reflowing at the wave thus causing shorts... The board was profiled with probes stuck to a QFP solder joint, an 0603, and one of the BGA joints. There was an almost
Electronics Forum | Sun Oct 10 18:53:04 EDT 1999 | Dreamsniper
| | | | Is there an IPC Standard stating the max. number of times that a PCB can pass through a reflow or wavesolder machine without having solder mask breakdown. | | | | | | | | PCB is FR4 | | | | Solder Mask is LPI | | | | Reflow and W/S Profile =
Electronics Forum | Thu Sep 30 07:03:05 EDT 1999 | Scott Cook
| Hi everyone, | | Greetings! | | I�ve got a 2-layered through-hole PCB�s having the following problems: | | Solder Mask peels after wave soldering at random locations and only at the bootom side of the PCB | Insufficient Solder and some solder ne
Electronics Forum | Fri Sep 24 10:57:18 EDT 1999 | Earl Moon
| Hi Folks: | | We've been having bridging problems on our fine-pitch QFP's, despite thorough inspection of paste height, volume, and placement accuracies....profiles look good also. | | The bridging is happening after coming out of reflow...one la
Electronics Forum | Thu Sep 23 17:28:54 EDT 1999 | JohnW
| | | Question for you SMT guru's out there. | | | | | | What is the best way to support boards on Fuji's CP6 machine's x-y table...particularly for 2nd side SMT where the support side already has parts... I am toying around with the following meth
