Electronics Forum | Wed Jul 31 08:23:49 EDT 2002 | mcm4me
221C). 2D vision can very effectively detect % pad coverage, I use it on my DEK and this customer has an MPM which I also believe to be capable. Here is another fact, when the customer uses Brand X solder paste the defects due to what they call pad
Electronics Forum | Fri Aug 02 11:48:23 EDT 2002 | johnw
I can't think of any off hand other than the Ersa which is massive and from when I used it a pain in the A*SE to program and keep programmed, you always seem to have to baby sit it. I bet if you asked you could get one, the problem is that forced con
Electronics Forum | Thu Sep 12 11:50:58 EDT 2002 | stepheno
http://www.jedec.org/download/search/jstd020b.pdf http://www.jedec.org/download/search/jstd033a.pdf The above links are for JEDEC standards regarding moisture sensitivity. SMT magazine has an article a few months ago regarding a company that saved
Electronics Forum | Fri Aug 30 00:47:53 EDT 2002 | TLe
Dave, you did not understand my problem right. We don�t get paste on the PCB in the printing phase of process. I have seen also poor wetting on OSP, as you descriped, but that is very unusual. I think generally OSP is better than gold/nickel if spea
Electronics Forum | Tue Sep 03 17:48:34 EDT 2002 | dphilbrick
My customer is finding a blue haze on some SMT pads after processing, kind of looks like a water spot on the surface of solder joints. It requires 20x mag and very good lighting to see. We have done 2 different ionic tests and the boards pass to clas
Electronics Forum | Tue Sep 03 22:32:04 EDT 2002 | davef
Naw, alcohol and solvents won't do dip. Hold-off on: * Destructive testing. [Athough this will convince you to move on to other things.] * Rework of the solder connections. [Although this will correct the problem.] Consider investigating your aque
Electronics Forum | Fri Sep 06 15:22:53 EDT 2002 | barryg
Genny, we recently went through the same scenerio. First to consider is your budget. Second , what type of components (fine pitch, bga, chip components)that you would be placing. Also consider board size max. that you would be doing and would see you
Electronics Forum | Thu Sep 12 10:45:29 EDT 2002 | pbarton
We have used a laser cut stencil 0.15mm (0.006") thick with 0.3mm (0.012") square apertures radiused in the corners 0.06mm (0.0025") to aid paste release. This approach with the (type 3) paste we use has proven successful on thousands of devices plac
Electronics Forum | Sun Sep 15 15:08:00 EDT 2002 | jersbo
My 2 cents... Screen printing may very well have a leg up on deciding SMT defects... however if you pay attention to your stencil (aperture size ratio etc..) and inspect your prints... I believe its a much lesser number... (paste MFG also plays a ro
Electronics Forum | Fri Sep 20 19:06:09 EDT 2002 | mjabure
The way it works is the first index is done with the feed cylinder, and the final is done using the cam during pick. You might want to check to make sure you're getting a full, complete stroke out of your feed cylinder, also make sure the mechanism
