Electronics Forum | Mon Sep 29 12:31:51 EDT 2008 | omid_juve
Thanks but we have QFP208 package here that after the reflow soldering during to the bad coplanarity of these devices some pads doesn`t have enough solder or not soldered. so we decided to use a qfp nozzle that can be placed on a QFP pads and use a
Electronics Forum | Thu Oct 02 08:24:32 EDT 2008 | rway
If you want to go really cheap, you could try Pace Systems. You can get a three channel system, hot air, desolder and soldering iron. Or any other combination handpieces that they offer, for around $3K. They also have power supplies with a single
Electronics Forum | Wed Oct 29 14:38:19 EDT 2008 | markhoch
Actually 0603 is 8mm x 4mm pitch. 0201 and 0402 are 8mm x 2mm pitch. 0603, 0805, 1206, 1210 are 8mm x 4mm pitch. Tant Caps 3216 & 3528 packages are 8mm X 4mm pitch. 6032 and 7343 are 12mm X 8mm pitch. ICs, Diodes, Transistors are various sizes and d
Electronics Forum | Tue Jan 27 02:00:40 EST 2009 | sachu_70
Your image does not clearly explain the problem. However, I can see a good heel fillet formation at the joint. In general, TSOP leads are delicate and should handled with immense caution and good ESD protection. First let us be clear that any "rework
Electronics Forum | Tue Mar 03 14:07:07 EST 2009 | macisaint
I'm having shorts appear on my QFN packages between pins, usually only after a week or so of power-on operation. The shorts are 1K and slowly down to hard shorts over time. Typically a defective part will have failures on multiple pins. I tried havi
Electronics Forum | Mon Sep 21 15:45:35 EDT 2009 | boardhouse
Hi Ryan, Standard shelf life for FR4 Non-RoHs & Rohs material with HASL or Lead Free HASL would be 12 months + in a controlled environment. on all RoHs materials over 6 months, we would suggest your board shop run a solder ability test before ship
Electronics Forum | Tue Mar 23 03:42:51 EDT 2010 | grahamcooper22
Hi, It is very important to follow IPC JEDEC 33 specification for storage and handing of all MSDs. In many instances defects caused by excess moisture in packages is not immediately evident (pcbs may pass final test) but when pcb has been in the fiel
Electronics Forum | Wed Sep 29 14:19:48 EDT 2010 | davef
In trying to understand your situation better, you say, "The problem is in production. It is difficult to solder SMT package. I was thinking of 1206 package." Please clarify: * What is difficult about hand soldering your SMT part? What is the part
Electronics Forum | Fri Oct 08 07:26:22 EDT 2010 | walkbury
Yes... I can generally get away with it for all but the low profile stuff such as tssop packages. The plastic tubes are so shallow anyway that once you've used a scalpel to create a pick up window, you've virtually got no side-wall left. Anything b
Electronics Forum | Tue Oct 26 16:41:05 EDT 2010 | sai
I have been trying to get the profile right for this part(OMAP3503DCBC) , but still struggle. I'm using the Herller 1809 MKIII oven. I look at the profile recomended by TI and still issue with the solder ball collaps and wetting. My peak temp @256
