Electronics Forum | Mon Jul 19 12:37:15 EDT 1999 | Wolfgang Busko
| | | | | Hi, SMTASSY | | | | that�s what we do, soldering our double-sided-finepitch-BGA-and all-the-other-stuff-boards in vapourphase because it�s the only thing we have. | | First, we do not do real series produktion, only prototyping up to som
Electronics Forum | Tue Jul 20 09:59:22 EDT 1999 | Vikram Butani
Hi Steve, What Earl says is true. You need a stand alone failure analysis/process verification system before you go inline. No matter what brand you choose, it is important to compare a few features, across the board: - X-ray source kV, mA, and f
Electronics Forum | Tue May 25 12:05:53 EDT 1999 | Deon Nungaray
| Just a note about cleaning stencils with a mixture of alcohol and water, especially if you're using no clean paste, it's really not recommended. | | Don't take my word for it, you can check with Alpha or most any other solderpaste vendor. What wil
Electronics Forum | Thu May 20 03:34:56 EDT 1999 | Earl Moon
| hello...can somebody help me regarding the POPCORN at Reflow. What is this POPCORN at reflow, what it looks like, its cause and corrective action if there is... | | your help is greatly appreciated...thanks | | omat marasigan | | Omat baby, Mo
Electronics Forum | Fri May 21 13:57:02 EDT 1999 | KA Stillings
| | hello...can somebody help me regarding the POPCORN at Reflow. What is this POPCORN at reflow, what it looks like, its cause and corrective action if there is... | | | | your help is greatly appreciated...thanks | | | | omat marasigan | | | |
Electronics Forum | Wed May 19 10:56:52 EDT 1999 | Glenn Robertson
| | | We are currently looking at purchasing some BGA rework equipment. Could someone give us the pro's and cons of IR heating (top/bottom)vs. hot air convection ? | | | All other tips are also welcome. | | | | | | Thanks | | | | | Philip, | | M
Electronics Forum | Fri May 07 17:02:01 EDT 1999 | Earl Moon
| On 1.27mm (0.050 inches) Standard Ball Grid Array's. | The ball size diameter starts at approximately 0.025 inches. | | If the ball size decreases to 0.012 inches (due to the solder flowing down a via) is the solder connection reliable? | | This
Electronics Forum | Thu May 13 18:36:55 EDT 1999 | Andrew Wulff
| | On 1.27mm (0.050 inches) Standard Ball Grid Array's. | | The ball size diameter starts at approximately 0.025 inches. | | | | If the ball size decreases to 0.012 inches (due to the solder flowing down a via) is the solder connection reliable? |
Electronics Forum | Tue Mar 30 10:57:54 EST 1999 | Steve Gregory
Hello, I'm a student assistant in a research project that deals with the simulation of PCB assembly systems. At the moment I collect information about SMDs. My problem is how to assign the correct feeder width to various devices in a simulation. Is
Electronics Forum | Sat Jan 23 13:29:40 EST 1999 | Earl Moon
| Hi Everyone, | We plan to build, for reliability/experimental/research purpose some CSPs (namely Tessera microBGA 46-I/O 0/75mm pitch and TI 64 I/O 0/8 mm pitch). the various factors that we plan to evaluate are the reliability and assembly concern
