Electronics Forum | Thu Dec 24 13:29:19 EST 1998 | Chris Grendler
| | Anyone ever attach gold bump flip chip to FR4 or Alumina substrates. Am trying to find a solder which is acceptable for use on gold. Am worried about gold imbrittlement since the gold bumps on the flip chip are .004"x.004"x.001" solid gold. The
Electronics Forum | Tue Sep 22 09:07:02 EDT 1998 | Steve Gregory
Hi Jacqueline! Do these joints that you're having problems with happen to be on fine pitch solder joints? Are the fillets staying attached to the foot and separating from the pads cleanly? If that is true, are there many vias concentrated aroun
Electronics Forum | Wed Sep 09 07:40:20 EDT 1998 | Jon Medernach
What is the pitch of the bumped die? What is the method of attach? C4? Key features required for FC attach include. Ability to program and measure Z force, system should calibrate on startup. Placement accuracy will determine pitch you can place.
Electronics Forum | Fri Jun 26 09:01:25 EDT 1998 | Justin Medernach
| | Hi all, | | I've received an interesting opportunity. I'm in the contract mfg. game at the prototype level. I have a chance to build a Flip Chip test vehicle. I know little about the process but am very familiar with the packaging / process te
Electronics Forum | Mon Feb 23 23:42:11 EST 1998 | Mike
| Can anyone give me any info on the effective removal of BGA's? I need to be able to take a variety of BGA's off boards quickly without creating pad damage. I am not yet concerned about the re-attach process. Depending on your rework station,Useing
Electronics Forum | Mon Mar 30 16:29:31 EST 1998 | Tony Arteaga
| | Can anyone give me any info on the effective removal of BGA's? I need to be able to take a variety of BGA's off boards quickly without creating pad damage. I am not yet concerned about the re-attach process. | Depending on your rework station,| U
Electronics Forum | Tue Aug 07 08:20:47 EDT 2001 | CPI
Are there other components on the board? If so, how does solder quality look on them? Are they all reflowing? Are the sections of the uBGA�s sitting on a ground plane? Sounds like un-even heating. You should attach a couple thermal couples and see h
Electronics Forum | Mon Mar 21 02:51:23 EST 2005 | amstech
I have done few thermocouples using high lead solder, silver epoxy that is used for die attach purposes and some X - non conductive material. Though all materials show a slight variation in temperatures (3 to 5 degree C), the dwell time at peak is qu
Electronics Forum | Tue Mar 21 19:34:32 EST 2006 | Tom Smykowski
Omar: I dealt with this so called "hot bar" process also, and you're right; it's neither reliable nor repeatable. The goal was to attach a flex LCD display to another flex circuit. The flex LCD was constructed of resin and conductive silver particl
Electronics Forum | Wed Dec 20 23:29:32 EST 2006 | Jack
Hi all, Is there anyone know the correct way to obtain the accurate temperature profiling for oven reflow? Are below claims true? (1) Instead of full components on the PCBA (Motherboard), the profile taken from PCBA with few components can be cons
